Metal mesh is a promising material for flexible transparent conducting electrodes due to its outstanding physical and electrical properties. The excellent control of the sheet resistance and transmittance provided by the metal mesh electrodes is a great advantage for microelectronic applications. Thus, over the past decade, many studies have been performed in order to realize high-performance metal mesh; however, the lack of cost-effective fabrication processes and the weak adhesion between the metal mesh and substrate have hindered its widespread adoption for flexible optoelectronic applications. In this study, a new approach for fabricating robust silver mesh without using hazardous organic solvents is achieved by combining colloidal deposition and silver enhancement steps. The adhesion of the metal mesh was greatly improved by introducing an intermediate adhesion layer. Various patterns relevant to optoelectronic applications were fabricated with a minimum feature size of 700 nm, resulting in high optical transmittance of 97.7% and also high conductivity (71.6 Ω sq −1 ) of the metal mesh. In addition, we demonstrated an effective transparent heater using the silver mesh with excellent exothermic behavior, which heated up to 245 °C with 7 V applied voltage.