1997
DOI: 10.1147/rd.411.0081
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Negative photoresists for optical lithography

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Cited by 317 publications
(233 citation statements)
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“…Previous works have reported a 0.22 Poisson ratio for the SU-8 polymer [12], assuming then a similar membrane behavior to expression (1) when a real pressure is applied. In order to verify the theoretical analysis before determining the appropriate dimensions for the membrane, software tool Coventorware was used to simulate the phenomenon involved in valve operation.…”
Section: Mechanical Actuationmentioning
confidence: 54%
“…Previous works have reported a 0.22 Poisson ratio for the SU-8 polymer [12], assuming then a similar membrane behavior to expression (1) when a real pressure is applied. In order to verify the theoretical analysis before determining the appropriate dimensions for the membrane, software tool Coventorware was used to simulate the phenomenon involved in valve operation.…”
Section: Mechanical Actuationmentioning
confidence: 54%
“…However, SU-8 is an epoxy-based negative photoresist, which consists of epoxies and photoinitiators (triarylsulfonium salts). 28 After exposure, SU-8 is polymerized by cationic photopolymerization processes, which releases hexafluoroantimonate complexes (SbF 6 2 ) from photoinitiators for further polymerization processes. In our experiment, the SU-8 is exposed by a 500% over dosage, meaning most of the photoinitiator is reacted, and then generates large amount of SbF 6 2 .…”
Section: Principle and Fundamental Studies Sessile Drop Experimentsmentioning
confidence: 99%
“…[1][2][3] Commercially available formulations (Shell Chemical, MicroChem) provide a macromonomer 1 (Scheme 1) dissolved in γ-butyrolactone at different concentrations. 1 These different formulations are spin-coated onto a wide range of substrates giving raise to a range of film thicknesses in the range 1 to 100µm, depending on the viscosity of the original solution and the spin speed. [1][2][3] They also contain a photoacid to initiate polymerization of the epoxide groups upon UV exposure.…”
Section: Introductionmentioning
confidence: 99%
“…1 These different formulations are spin-coated onto a wide range of substrates giving raise to a range of film thicknesses in the range 1 to 100µm, depending on the viscosity of the original solution and the spin speed. [1][2][3] They also contain a photoacid to initiate polymerization of the epoxide groups upon UV exposure. [1][2][3] The resulting polymerized resin is a highly crosslinked polymer, the hardness of which depends on the time and energy of the UV exposure and post-exposure baking times and temperatures.…”
Section: Introductionmentioning
confidence: 99%