2010 IEEE International Solid-State Circuits Conference - (ISSCC) 2010
DOI: 10.1109/isscc.2010.5433943
|View full text |Cite
|
Sign up to set email alerts
|

Negative-resistance read and write schemes for STT-MRAM in 0.13µm CMOS

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
27
0
1

Year Published

2012
2012
2022
2022

Publication Types

Select...
4
3

Relationship

0
7

Authors

Journals

citations
Cited by 44 publications
(28 citation statements)
references
References 4 publications
0
27
0
1
Order By: Relevance
“…The average power consumption of a write-operation is mainly determined by the average pulse-width of the write-pulses. In a conventional scheme [6,10,12], every write-pulse has the same pulse-width, which is determined by the longest switching time to be accommodated. If we assume that variation of switchingtime follows Gaussian distribution, the write error-rate (ER) can be expressed as function of write-pulse width (t w ) by…”
Section: Simulation Resultsmentioning
confidence: 99%
See 3 more Smart Citations
“…The average power consumption of a write-operation is mainly determined by the average pulse-width of the write-pulses. In a conventional scheme [6,10,12], every write-pulse has the same pulse-width, which is determined by the longest switching time to be accommodated. If we assume that variation of switchingtime follows Gaussian distribution, the write error-rate (ER) can be expressed as function of write-pulse width (t w ) by…”
Section: Simulation Resultsmentioning
confidence: 99%
“…Usually reference cells are designed with two MTJs in opposite states connected in series or in parallel as shown in Fig. 3 [6,12,15]. Fig.…”
Section: Reference Cellmentioning
confidence: 99%
See 2 more Smart Citations
“…For example, one of the well-known challenges in STT-MRAM is the high write cost due to the STT mechanism, which makes STT-MRAM prone to multi-bit write errors. A lot of techniques have been proposed, such as decreasing the thickness of barrier layer, adopting various circuit level approached or designing new architecture [8,9,10,11,12], to alleviate the issue. Nevertheless, these techniques may degrade the STT-MRAM performance and thus limit its usages in high-speed and low-power working memory applications.…”
Section: Introductionmentioning
confidence: 99%