1968
DOI: 10.1109/tns.1968.4324902
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Neutron Radiation Damage in Silicon Transistors

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Cited by 14 publications
(15 citation statements)
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“…Four basic processes were assumed to be involved in this recombination-generation through the recombination centers: 1) hole capture; 2) hole emission; 3) electron capture; and 4) electron emissionl,2,4. In order to study the nuclear radiation effects on silicon p-n junction transistors, the last component in Table I-1 was considered throughout this in- [8][9][10][11][12] vestigation. This component was identified by Goben and has the following expression One important limitation of transistors operated in a neutron environment is the decrease in transistor current gain observed upon exposure to neutron irradiation.…”
Section: Readmentioning
confidence: 99%
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“…Four basic processes were assumed to be involved in this recombination-generation through the recombination centers: 1) hole capture; 2) hole emission; 3) electron capture; and 4) electron emissionl,2,4. In order to study the nuclear radiation effects on silicon p-n junction transistors, the last component in Table I-1 was considered throughout this in- [8][9][10][11][12] vestigation. This component was identified by Goben and has the following expression One important limitation of transistors operated in a neutron environment is the decrease in transistor current gain observed upon exposure to neutron irradiation.…”
Section: Readmentioning
confidence: 99%
“…space-charge region, when the transistor is [8][9][10][11][12] exposed to neutron irradiation it was shown that the emitter efficiency is indeed a very sharply decreasing function of neutron fluence and is responsible for a large fraction of the neutron degradation of transistor current gain. Transistors provide a definite advantage over semiconductor bulk materials for studying radiation effects since they permit measurement of base lifetime in the range from several hundred microseconds down to the nanosecond range, .whereas determination of lifetime by photoconductivity in bars of semiconductor material is in general limited to the range greater than one microsecond.…”
Section: Readmentioning
confidence: 99%
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