2006 1st Electronic Systemintegration Technology Conference 2006
DOI: 10.1109/estc.2006.279996
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New Accelerating Test Methods for Board Level Solder Joints and Thermal Caused Failure Mechanisms in High Temperature Electronics

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“…The generalized log-linear model [9] and the generalized multiplicative model [27] are examples of such applications. Several authors ( [12], [13], [16], [17], [19], [40], [44], [45]) have used a combination of two single stress models to achieve the same goal. These examples demonstrate the fact that a multi-variable scenario is unavoidable in many engineering situations as most of the common failure modes have multivariable relationships.…”
Section: Some Authors Have Also Used Hazard Regression Methods As Altmentioning
confidence: 99%
“…The generalized log-linear model [9] and the generalized multiplicative model [27] are examples of such applications. Several authors ( [12], [13], [16], [17], [19], [40], [44], [45]) have used a combination of two single stress models to achieve the same goal. These examples demonstrate the fact that a multi-variable scenario is unavoidable in many engineering situations as most of the common failure modes have multivariable relationships.…”
Section: Some Authors Have Also Used Hazard Regression Methods As Altmentioning
confidence: 99%