New approach to laser direct writing active and passive mesoscopic circuit elements

Chrisey, Douglas B.; Piqué, Alberto; Fitzgerald, James W.; Auyeung, R. C. Y.; McGill, R. Andrew; Wu, Houzheng; Duignan, Michael T.

doi:10.1016/s0169-4332(99)00465-1

Cited by 120 publications

(49 citation statements)

References 11 publications

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“…Variations on the general LIFT principle allow liquids, inks, and multiphase solutions to be patterned with computer-controlled accuracy for use in a variety of applications such as passive electronics or sensors. 27,28 Alternatively, LDWϩ techniques can rely on optical forces to push particles or clusters into precise positions, 29 or on chemical changes in liquids and gases to produce patterns. For instance, laser-induced chemical vapor deposition, 30 or multiphoton polymerization schemes of liquid photoresists, 31 can be used to fabricate three-dimensional stereographic patterns.…”

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confidence: 99%

Laser Direct-Write Processing

Arnold¹,

Piqué²

2007

MRS Bull.

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Direct-write techniques enable computer-controlled two-and three-dimensional pattern formation in a serial fashion. Among these techniques, the versatility offered by laser-based direct-write methods is unique, given their ability to add, remove, and modify different types of materials without physical contact between a tool or nozzle and the material of interest. Laser pulses used to generate the patterns can be manipulated to control the composition, structure, and even properties of individual three-dimensional volumes of materials across length scales spanning six orders of magnitude, from nanometers to millimeters. Such resolution, combined with the ability to process complex or delicate material systems, enables laser direct-write tools to fabricate structures that are not possible to generate using other serial or parallel fabrication techniques. The goal of the articles in this issue of MRS Bulletin is to illustrate the range of materials processing capabilities, fundamental research opportunities, and commercially viable applications that can be achieved using recently developed laser direct-write techniques. We hope that the articles provide the reader with a fresh perspective on the challenges and opportunities that these powerful techniques offer for the fabrication of novel devices and structures.

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confidence: 99%

Laser Direct-Write Processing

Arnold¹,

Piqué²

2007

MRS Bull.

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“…Ce procédé nécessite cependant l'utilisation d'un solvant qui joue le rôle de matrice de transfert. Bien que relativement compliqué à mettre en oeuvre, il a permis de réaliser des structures telles que des résistances de quelques centaines de micromètres et des capacités de dimensions millimétriques [9].…”

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Ablation laser pour la microélectronique plastique

et al. 2006

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Résumé. La microélectronique plastique connaît un développement sans précédent dans le domaine de la recherche. Cette étude s'intéresse à l'utilisation des lasers impulsionnels pour la réalisation de composants organiques sur supports souples. Les deux aspects plus particulièrement étudiés sont d'une part la gravure de polymère pour réaliser un canal entre la source et le drain, et d'autre part le développement d'un procédé de dépôt appelé LIFT pour Laser Induced Forward Transfer. Ce dernier pourrait notamment permettre de déposer des composés organiques non solubles.

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“…It is envisaged that thermoelectric and other sensors, EMI shielding and heat sinks can also be integrated following a given design concept. Progress has been made with techniques such as NRL's MAPLE DW [43] by which a variety of electronic elements were accurately deposited on substrates and TA&Ts stereo-photolithography [44] by which fully dense, narrow silver lines were deposited on ceramic substrates. The goal is to develop an automated process for electronic packaging having high resolution and high level of integration.…”

Section: Lm Opportunitiesmentioning

confidence: 99%

Layered Manufacturing: Challenges and Opportunities

Cooper

2002

MRS Proc.

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Layered Manufacturing (LM) refers to computer-aided manufacturing processes in which parts are made in sequential layers relatively quickly. Parts that are produced by LM can be formed from a wide range of materials such as photosensitive polymers, metals and ceramics in sizes from a centimeter to a few meters with sub-millimeter feature resolutions. LM has found use in diverse areas including biomedical engineering, pharmaceuticals, aerospace, defense, electronics and design engineering. The promise of LM is the capability to make customized complex-shaped functional parts without specialized tooling and without assembly. LM is still a few years away from fully realizing its promise but its potential for manufacturing remains high. A few of the fundamental challenges in materials processing confronting the community are improving the quality of the surface finish, eliminating residual stress, controlling local composition and microstructure, achieving fine feature size and dimensional tolerance and accelerating processing speed. Until these challenges are met, the applicability of LM and its commercialization will be restricted. Sustained scientific activity in LM has advanced over the past decade into many different areas of manufacturing and has enabled exploration of novel processes and development of hybrid processes. The research community of today has the opportunity to shape the future direction of science research to realize the full potential of LM.

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New approach to laser direct writing active and passive mesoscopic circuit elements

Cited by 120 publications

References 11 publications

Laser Direct-Write Processing

Laser Direct-Write Processing

Ablation laser pour la microélectronique plastique

Layered Manufacturing: Challenges and Opportunities

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