2012
DOI: 10.1051/epjconf/20123302010
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New DRIE-Patterned Electrets for Vibration Energy Harvesting

Abstract: Abstract. This paper is about a new manufacturing process aimed at developing stable SiO 2 /Si 3 N 4 patterned electrets using a Deep Reactive Ion Etching (DRIE) step for an application in electret-based Vibration Energy Harvesters (e-VEH). This process consists in forming continuous layers of SiO 2 /Si 3 N 4 electrets in order to limit surface conduction phenomena and is a new way to see the problem of electret patterning. Experimental results prove that patterned electrets charged by a positive corona discha… Show more

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Cited by 9 publications
(2 citation statements)
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“…For similar electret structures and charging procedure to our devices, Boisseau suggests in [26] that the charges are homogeneously distributed over the whole surface. We are however not able to confirm this information for our harvesters due to the large surface of the probe in the non-contacting electrostatic voltmeter.…”
Section: Introductionmentioning
confidence: 86%
“…For similar electret structures and charging procedure to our devices, Boisseau suggests in [26] that the charges are homogeneously distributed over the whole surface. We are however not able to confirm this information for our harvesters due to the large surface of the probe in the non-contacting electrostatic voltmeter.…”
Section: Introductionmentioning
confidence: 86%
“… CEA-LETI [51] Contrary to the previous methods, the goal of this electret patterning method is to make continuous electret layers. Actually, instead of patterning the electret, it is the substrate of the electret (the silicon wafer) that is patterned thanks to a Deep Reactive Ion Etching (DRIE).…”
Section: Sanyo and The University Of Tokyomentioning
confidence: 99%