New epoxy-imide resins cured with N-(3-hydroxyphenyl)trimellitimide: synthesis, thermal and adhesive properties

Abstract

N-(3-hydroxyphenyl)trimellitimide (NHPTI) was synthesised through the reaction of m-aminophenol and trimellitic acid anhydride. Then epoxy-imide resins were prepared by curing the epoxy resin (CYD-128: DGEBA) with NHPTI. The curing reaction of NHPTI and CYD-128 was investigated by the methods of FTIR, DSC, etc. It was found that the esterification reaction had occurred between the epoxy and the phenyl carboxyl or hydroxyl groups of NHPTI. Moreover, the curing reaction could be accelerated by 2-ethyl-4-methylimidazole (2-MZ) as a catalyst. The cured epoxy-imide resins showed good thermal stability and adhesive properties. Thermogravimetric analysis indicated that the imide groups incorporated could have a profound effect on increasing char yield and on thermal degradation temperatures.

Experimental Determination of the Standard Enthalpy of Formation of Trimellitic Acid and Its Prediction by Supervised Learning

“…Trimellitic acid (TMAc) is a compound used as a ligand on coordination polymers, as precursors of polyester resins and polyamide-imides, − furthermore like cross-linking agents for paints, dyes, and adhesives, and for other important chemicals production. , In addition, the trimellitic acid particular chemical structure such as the carboxylic groups that allows the intermolecular hydrogen bonds formation renders this compound to other potential applications in organometallic and inorganic chemistry, i.e., for semisynthetic natural products, and in materials research field . A quick search for literature in SciFinder limited to the last 5 years yields more than 1400 for TMAc, which mainly corresponds to patents.…”