New fabrication of high-frequency (100-MHz) ultrasound PZT film kerfless linear array [Correspondence]

Zhu, Benpeng; Chan, Ngai Yui; Shung, K. Kirk; Takeuchi, Shinichi; Zhou, Qifa

doi:10.1109/tuffc.2013.2635

Cited by 27 publications

(14 citation statements)

References 25 publications

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“…A notable advancement was made by Brown et al by developing a miniaturized, forward looking 40 MHz phased array that utilized a novel electrical interconnection technique where wire bonding connected the array composite to metalized vias in a flex circuit [21]. Kerfless high frequency array development has been investigated as a fabrication method that avoids the problem of creating kerfs in the piezoelectric material and instead relies on simply patterning electrodes to create individual elements in an array at the expense of increased crosstalk between elements [22], [23]. Both thick and thin film deposition techniques have also been investigated for high frequency array development [24], [25].…”

Section: Methodsmentioning

confidence: 99%

High-Frequency Ultrasound Array Designed for Ultrasound-Guided Breast Biopsy

Cummins

Eliahoo

Shung

2016

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

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This paper describes the development of a miniaturized high frequency linear array that can be integrated within a core biopsy needle to improve tissue sampling accuracy during breast cancer biopsy procedures. The 64 element linear array has an element width of 14 μm, kerf width of 6 μm, element length of 1 mm and element thickness of 24 μm. The 2–2 array composite was fabricated using deep reactive ion etching of PMN-PT single crystal material. The array composite fabrication process as well as a novel high density electrical interconnect solution are presented and discussed. Array performance measurements show that the array had a center frequency and fractional bandwidth (−6 dB) of 59.1 MHz and 29.4%, respectively. Insertion loss and adjacent element cross talk at the center frequency were −41.0 dB and −23.7 dB, respectively. A B-mode image of a tungsten wire target phantom was captured using a synthetic aperture imaging system and the imaging test results demonstrate axial and lateral resolutions of 33.2 μm and 115.6 um, respectively.

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Section: Methodsmentioning

confidence: 99%

High-Frequency Ultrasound Array Designed for Ultrasound-Guided Breast Biopsy

Cummins

Eliahoo

Shung

2016

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

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“…This power amplifier circuit consists of two stages, and the total gain of V out /V in of each stage can be obtained as follows. Using Equations (15), (18), and (19), the gain of the first stage is…”

Section: Equivalent Circuit Analysis Of a Two-stage Power Amplifiermentioning

confidence: 99%

“…To increase the bandwidth of the ultrasonic devices, the mechanical damping material is one of the design solution [18]. This material is useful to increase the bandwidth of the ultrasonic devices [19]. However, large size material, which has high acoustic impedance, could increase the bandwidth, and lower the sensitivity of the ultrasonic devices, because the mechanical damping absorb the part of the acoustic powers [20,21].…”

Section: Introductionmentioning

confidence: 99%

Wide Bandwidth Class-S Power Amplifiers for Ultrasonic Devices

You

Choi

2020

Sensors

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Wide bandwidth ultrasonic devices are a necessity in high-resolution ultrasonic systems. Therefore, constant output voltages need to be produced across the wide bandwidths of a power amplifier. We present the first design of a wide bandwidth class-S power amplifier for ultrasonic devices. The −6 dB bandwidth of the developed class-S power amplifier was measured at 125.07% at 20 MHz, thus, offering a wide bandwidth for ultrasonic devices. Pulse-echo measurement is a performance measurement method used to evaluate the performance of ultrasonic transducers, components, or systems. The pulse-echo signals were obtained using an ultrasonic transducer with designed power amplifiers. In the pulse-echo measurements, time and frequency analyses were conducted to evaluate the bandwidth flatness of the power amplifiers. The frequency range of the ultrasonic transducer was measured and compared when using the developed class-S and commercial class-A power amplifiers with the same output voltages. The class-S power amplifiers had a relatively flat bandwidth (109.7 mV at 17 MHz, 112.0 mV at 20 MHz, and 109.5 mV at 23 MHz). When the commercial class-A power amplifier was evaluated under the same conditions, an uneven bandwidth was recorded (110.6 mV at 17 MHz, 111.5 mV at 20 MHz, and 85.0 mV at 23 MHz). Thus, we demonstrated that the designed class-S power amplifiers could prove useful for ultrasonic devices with a wide frequency range.

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“…Piezoelectric thick films have already been explored for high frequency ultrasonic single element transducers and linear arrays for medical imaging [41][42][43]. Depending on the desired thickness and shape of the PZT film, different thick film techniques can be used, such as modified sol-gel [44], hydrothermal deposition [45], aerosol deposition [46], electrophoretic deposition [47], ink-jet printing [48], pad-printing [49] and screen-printing [50]. Among these methods, screen-printing allows relatively simple fabrication of patterned films with typical thicknesses between 10 and 150 lm with excellent reproducibility.…”

Section: Introductionmentioning

confidence: 99%

Screen-printed ultrasonic 2-D matrix array transducers for microparticle manipulation

et al. 2015

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This paper reports the development of a two-dimensional thick film lead zirconate titanate (PZT) ultrasonic transducer array, operating at frequency approximately 7.5MHz, to demonstrate the potential of this fabrication technique for microparticle manipulation. All layers of the array are screen-printed then sintered on an alumina substrate without any subsequent patterning processes. The thickness of the thick film PZT is 139±2μm, the element pitch of the array is 2.3mm, and the dimension of each individual PZT element is 2×2mm(2) with top electrode 1.7×1.7mm(2). The measured relative dielectric constant of the PZT is 2250±100 and the dielectric loss is 0.09±0.005 at 10kHz. Finite element analysis was used to predict the behaviour of the array and to optimise its configuration. Electrical impedance spectroscopy and laser vibrometry were used to characterise the array experimentally. The measured surface motion of a single element is on the order of tens of nanometres with a 10Vpeak continuous sinusoidal excitation. Particle manipulation experiments have been demonstrated with the array by manipulating Ø10μm polystyrene microspheres in degassed water. The simplified array fabrication process and the bulk production capability of screen-printing suggest potential for the commercialisation of multilayer planar resonant devices for ultrasonic particle manipulation.

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New fabrication of high-frequency (100-MHz) ultrasound PZT film kerfless linear array [Correspondence]

Cited by 27 publications

References 25 publications

High-Frequency Ultrasound Array Designed for Ultrasound-Guided Breast Biopsy

High-Frequency Ultrasound Array Designed for Ultrasound-Guided Breast Biopsy

Wide Bandwidth Class-S Power Amplifiers for Ultrasonic Devices

Screen-printed ultrasonic 2-D matrix array transducers for microparticle manipulation

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