New Methods for Laser Cleaning of Nanoparticles

Luk’yanchuk, Boris; Song, Wen‐Dong; Wang, Z. B.; Hong, Ming Hui; Chong, T. C.; Graf, J.; Mosbacher, Mario; Leiderer, Paul

doi:10.1007/978-0-387-30453-3_3

Cited by 3 publications

(1 citation statement)

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“…Also, the possibility to remove particles from substrates other than silicon and even structured substrates will be the objectives of future experiments. Nevertheless, we already show that matrix laser cleaning is a powerful tool for damage free removal of the smallest particles from silicon wafers (see also some preliminary results in [24]). In combination with a conventional precleaning step followed by a selective matrix laser cleaning step of the remaining particles, this technique might be an alternative to conventional techniques in the future.…”

Section: Discussionmentioning

confidence: 85%

Matrix laser cleaning: a new technique for the removal of nanometer sized particles from semiconductors

et al. 2007

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In this paper a new laser-based technique for the removal of nanoparticles from silicon wafers, called matrix laser cleaning, is introduced. In contrast to the already existing technique dry laser cleaning damages of the substrate can be avoided. Furthermore no liquids are used, avoiding problems that occur, e.g. in steam laser cleaning and other wet cleaning techniques. We show that damage free particle removal of polystyrene particles with diameters of at least down to 50 nm is possible with a cleaning efficiency very close to 100% within a single shot experiment. Furthermore the cleaning threshold is independent of the particle size.

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Section: Discussionmentioning

confidence: 85%