1995
DOI: 10.1016/0924-4247(95)00987-6
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New methods for measuring mechanical properties of thin films in micromachining: Beam pull-in voltage (VPI) method and long beam deflection (LBD) method

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Cited by 60 publications
(30 citation statements)
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“…In MEMS, micromachined beams undergoing Euler buckling have been successfully used for this purpose. Prestrains of polysilicon [5], [8] and silicon oxide [10] have been measured. More complex buckled structures have been used to determine residual strains of diamond-like carbon [11], silicon oxide [12], and polysilicon thin films [9].…”
Section: Introductionmentioning
confidence: 99%
“…In MEMS, micromachined beams undergoing Euler buckling have been successfully used for this purpose. Prestrains of polysilicon [5], [8] and silicon oxide [10] have been measured. More complex buckled structures have been used to determine residual strains of diamond-like carbon [11], silicon oxide [12], and polysilicon thin films [9].…”
Section: Introductionmentioning
confidence: 99%
“…It will be helpful to design and optimize related MEMS devices, as well as to implement process monitoring and material property extraction. In the case of single-layer cantilever and fixed-fixed beams, Zou et al (1995), and Gupta (1997) have studied the analytical model of pullin voltage. Nemirovsky (2001) presented a generalized model of pull-in voltage.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, it is of significant interest to know the value of this parameter since knowledge of Young's modulus is required both for analysis and design. Significant amount of methods have been devoted to determining Young's modulus experimentally, which are categorized as static 2,3 and dynamic [4][5][6] .…”
Section: Introductionmentioning
confidence: 99%