2013
DOI: 10.1016/j.apsusc.2013.03.096
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New model for low-temperature oxidation of copper single crystal

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Cited by 57 publications
(47 citation statements)
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“…Indeed, it was found that polycrystalline film oxidation kinetics is almost twice as slow as single crystal oxidation kinetics 285 . The oxidation temperature is another factor [288][289][290] . O'Reilly 289 et al found for a polycrystalline sample in dry synthetic air (O 2 /Ar mixture) that at temperatures between 250 and 500 • C the oxidation followed a cubic law, at 100 • C an inverse log rate and at 150 • C a linear growth rate.…”
Section: Long-term Copper Oxidationmentioning
confidence: 99%
“…Indeed, it was found that polycrystalline film oxidation kinetics is almost twice as slow as single crystal oxidation kinetics 285 . The oxidation temperature is another factor [288][289][290] . O'Reilly 289 et al found for a polycrystalline sample in dry synthetic air (O 2 /Ar mixture) that at temperatures between 250 and 500 • C the oxidation followed a cubic law, at 100 • C an inverse log rate and at 150 • C a linear growth rate.…”
Section: Long-term Copper Oxidationmentioning
confidence: 99%
“…[11][12][13] Using ex situ energy-dispersive Xray spectroscopy (EDS), Cuenya and co-workers reported that al arge fraction of the initial oxide can be resistant to reduction even under strongly reducing potentials typically used for CO 2 R. [11,12] They proposed that the presence of Cu + on the surface was important for the formation of C 2 /C 3 products. [19][20][21][22][23] It is therefore possible that OD Cu can rapidly reoxidize,a nd as ar esult the O content characterized ex situ would not be representative of the actual case during CO 2 R.To address these concerns,w ee mployed 18 Oi sotope labeling to confirm the presence/absence of residual oxides in OD Cu during CO 2 R. 18 Oe nriched OD Cu catalysts were synthesized by oxidation/reduction cycling in H 2 18 Ofollowing the procedure of Nilsson and co-workers (see the Supporting Information for full details). [14] First-principles calculations performed by Goddard and co-workers found that the presence of oxygen in the subsurface would generate am ix of Cu + and Cu 0 on the surface.…”
mentioning
confidence: 99%
“…1) Cu nanomaterials have been shown to readily oxidize,which could create difficulties in performing accurate ex situ quantification of the oxygen content; [17,18] 2) Moisture and oxygen are known to cause corrosion (oxidation) of Cu and exposure to both is difficult to avoid;corrosion might also be exacerbated in aporous,high surface area material such as OD Cu;3 )ODC up ossesses ah igh density of grain boundaries,w hich are known to accelerate the oxidation process by serving as nucleation sites and as pathways where diffusion can occur at afaster rate. [19][20][21][22][23] It is therefore possible that OD Cu can rapidly reoxidize,a nd as ar esult the O content characterized ex situ would not be representative of the actual case during CO 2 R.…”
mentioning
confidence: 99%
“…Recently, a detailed study of oxidation mechanism of the formation of Cu 2 O on copper surface was reported by Fujita et al [34]. For typical partial pressure of oxygen of 1.01 kPa, the formation of a 2 nm layer requires *10 ks at 60°C.…”
Section: Resultsmentioning
confidence: 97%