Proceedings of 9th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors — PoS 2010
DOI: 10.22323/1.098.0029
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New perspectives for the Silicon-On-Diamond material

Abstract: A recent laser bonding technique has been developed to prepare silicon-on-diamond material. This method allows the independent choice of the quality of the silicon and diamond plates to be processed. This opens a wide field of applications for silicon-on-diamond devices. We present and discuss the laser technique and the experimental results achieved. Two new projects involving relevant issues both in high energy physics and in biological applications are also presented.

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Cited by 2 publications
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“…This work is part of the program which has been recently started by the INFN (Firenze, Perugia, Bari) and IIT (Genova) researchers in the frame of the CHIPSODIA collaboration [1]. Its aims stem from the availability of the laser technique [2], [3] according to which it is possible to solder Silicon and Diamond (Dia) dies whatever their material quality is.…”
Section: Introductionmentioning
confidence: 99%
“…This work is part of the program which has been recently started by the INFN (Firenze, Perugia, Bari) and IIT (Genova) researchers in the frame of the CHIPSODIA collaboration [1]. Its aims stem from the availability of the laser technique [2], [3] according to which it is possible to solder Silicon and Diamond (Dia) dies whatever their material quality is.…”
Section: Introductionmentioning
confidence: 99%