New phenomenon: Cellular boundary during the isothermal stage in the Sn-3Ag/(0 0 1)Cu and Sn-3.5Ag/(0 0 1)Cu joint

Dong, Chong; Yao, Jinye; Shang, Min; Ma, Haoran; Ma, Haitao; Wang, Yunpeng

doi:10.1016/j.matlet.2022.132110

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2022

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“…The use of Pb-free solders joints is getting promotion and significant research interest because of the immense benefit to environment and human health [1], [2]. For Sn-based solder joints using Cu substrates, the formation of joint is guaranteed by the growth of Cu 6 Sn 5 intermetallic compound (IMC) at the interface.…”

Section: Introductionmentioning

confidence: 99%

Crystal structure informed mesoscale deformation model for HCP Cu₆Sn₅ intermetallic compound

Kunwar

Hektor³

2022

2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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In the electronic packaging and energy storage sectors, the study of Cu6Sn5 intermetallic compound (IMC) is getting more attention. At temperatures above 186 • C, this IMC exists in a hexagonal closed packed (HCP) crystalline structure. Crystal plasticity finite element simulations are performed on Cu6Sn5 IMC by taking the information about its lattice parameters and direction dependent elastic properties. Three types of models corresponding to deformations in basal, prismatic and pyramidal modes are developed. With the same type of loading in the elastic regime and boundary conditions, the results of the computations reveal the differences in displacement magnitudes among the three model types.

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Section: Introductionmentioning

confidence: 99%

Crystal structure informed mesoscale deformation model for HCP Cu₆Sn₅ intermetallic compound

Kunwar

Hektor³

2022

2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

Self Cite

View full text Add to dashboard Cite

show abstract

New phenomenon: Cellular boundary during the isothermal stage in the Sn-3Ag/(0 0 1)Cu and Sn-3.5Ag/(0 0 1)Cu joint

Cited by 1 publication

References 17 publications

Crystal structure informed mesoscale deformation model for HCP Cu₆Sn₅ intermetallic compound

Crystal structure informed mesoscale deformation model for HCP Cu₆Sn₅ intermetallic compound

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New phenomenon: Cellular boundary during the isothermal stage in the Sn-3Ag/(0 0 1)Cu and Sn-3.5Ag/(0 0 1)Cu joint

Cited by 1 publication

References 17 publications

Crystal structure informed mesoscale deformation model for HCP Cu6Sn5 intermetallic compound

Crystal structure informed mesoscale deformation model for HCP Cu6Sn5 intermetallic compound

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About

Crystal structure informed mesoscale deformation model for HCP Cu₆Sn₅ intermetallic compound

Crystal structure informed mesoscale deformation model for HCP Cu₆Sn₅ intermetallic compound