New Process for Selective Additive Metallization of Alumina Ceramic Substrates

Ermantraut, Eugen; Müller, Hagen; Eberhardt, W.; Ninz, Philipp; Kern, Frank; Gadow, R.; Zimmermann, André

doi:10.1109/tcpmt.2018.2881410

Cited by 13 publications

(7 citation statements)

References 19 publications

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“…As discussed in Figure a, for the ABS/MoO 3 composite, a part of Mo 6+ is reduced to Mo 5+ during laser activations, which is the essential reason for the oxygen vacancy generation in MoO 3 . These oxygen vacancies have contributions to the adsorption of Cu 2+ in the ECP solution, thus possibly further accelerating the ECP and enhancing the activity (Figure f). , The reduction of Mo 6+ to Mo 5+ is also observed on the PDMS/MoO 3 composite after laser activations, as shown in Figure S15.…”

Section: Resultsmentioning

confidence: 92%

“…These oxygen vacancies have contributions to the adsorption of Cu 2+ in the ECP solution, thus possibly further accelerating the ECP and enhancing the activity (Figure 5f). 25,48 The reduction of Mo 6+ to Mo 5+ is also observed on the PDMS/MoO 3 composite after laser activations, as shown in Figure S15.…”

Section: Methodsmentioning

confidence: 83%

“…Note that, during electroless gold plating, the diffusion of Cu to Au is severe, always causing an uneven surface of the Au−Cu layer and resulting in poor surface quality. 15,48 After placing these rectangular metal wires for 30 days in the air, the resistances of the Cu layer gradually increase due to the air oxidation; in contrast, the resistances of the Ni−Cu, Ag−Cu, and Au−Ni−Cu layers have no apparent changes due to high stability (Figure 7d). The mechanical adhesion properties of these metal layers to the ABS/MoO 3 composite were also evaluated using the scotch tape test according to ASTM D3359 (Figure 7e).…”

Section: Methodsmentioning

confidence: 99%

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Autocatalytic Laser Activator for Both UV and NIR Lasers: Preparation of Circuits on Polymer Substrates by Selective Metallization

Feng

Xiao

et al. 2022

ACS Appl. Mater. Interfaces

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In laser-induced selective metallization (LISM), conventional laser activators only work at a single laser wavelength. This study reported a new laser activator (MoO3) very suitable for both 355 nm UV and 1064 nm near-infrared (NIR) lasers for the first time. When applying MoO3 to polymers, the prepared Cu layer on laser-activated polymers showed a good conductivity (2.63 × 106 Ω–1·m–1) and excellent adhesion. Scanning electron microscopy, optical microscopy, and resistance analysis revealed the excellent LISM performance of the polymer/MoO3 composites, and the quality of the Cu layer prepared using the UV laser is much better than that using the NIR laser. The limit width of the copper wire prepared by the UV laser is as narrow as 30.1 μm. We also confirmed the mechanism of MoO3 initiating electroless copper plating after laser activation to be the autocatalytic mechanism, which is very different from the conventional reduction mechanism. The effect of laser activation was only to expose the MoO3 active species to the polymer surface. X-ray diffraction and tube experiments revealed that the activity of α·h-MoO3 was higher than that of α-MoO3. X-ray photoelectron spectroscopy indicated that a part of Mo6+ was reduced to Mo5+ during laser activations, leading to the increase of the oxygen vacancies in MoO3 and possibly further enhancing the activity of MoO3. Besides, the micro-rough structures caused by the laser on the polymer surface provided riveting points for successfully depositing the copper layer. The Ni–Cu, Ag–Cu, and Au–Ni–Cu layers were obtained via the continued deposit of other metals on the Cu layer. The resistances of these metal layers had much better stability than that of the neat Cu layer. Furthermore, the Au layer further enhanced the conductivity of the circuit. The proposed strategy is easy for large-scale industrial applications, which will greatly expand the application scenarios of the LISM field.

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Section: Resultsmentioning

confidence: 92%

Section: Methodsmentioning

confidence: 83%

Section: Methodsmentioning

confidence: 99%

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Autocatalytic Laser Activator for Both UV and NIR Lasers: Preparation of Circuits on Polymer Substrates by Selective Metallization

Feng

Xiao

et al. 2022

ACS Appl. Mater. Interfaces

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“…The previous papers results show that ECP can be conducted on the surface of Al 2 O 3 ceramics directly aer laser treatment without coating activators or sensitizers. [26][27][28] This shows that the laser has changed the reactivity of the ceramic surface. Fig.…”

Section: Al 2 O 3 Ceramic Surface Pre-activationmentioning

confidence: 99%

Research on laser-assisted selective metallization of a 3D printed ceramic surface

et al. 2020

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“…It is worth noting that several groups demonstrated laser irradiation can catalytically activate metal oxides such as Al 2 O 3 , CeO 2 , and ZrO 2 owing to the formation of oxygen vacancies of metal oxides and band structure modification. On the laser-irradiated area of metal oxides, metals such as Cu could be deposited during ELP by the promotion of electron transfer from the reducing agent to the metal ions of the ELP solution. − Inspired by the photocatalytic properties and adsorption behavior of ZnO toward Cu metal ions, we sought to explore the potential of ZnO NPs as new catalytic nanofillers for laser-induced selective ELP on 3D printed materials.…”

Section: Introductionmentioning

confidence: 99%

Photocurable Three-Dimensional Printing Resin to Enable Laser-Assisted Selective Electroless Metallization for Customized Electronics

Lee

Kim

Park

et al. 2021

ACS Appl. Polym. Mater.

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Integrating conductive metal patterns directly on three-dimensional (3D) printed polymers is crucial for realizing diverse 3D printing applications. In this study, we developed photocurable 3D printing resins incorporating ZnO nanoparticles (3DP-ZnO) for 3D printed structures, which enabled subsequent copper (Cu) electroless plating (ELP). ZnO nanoparticles (NPs) were incorporated in the resin as catalytic seeds for ELP, and Cu patterns were precisely fabricated on 3DP-ZnO after 355 nm UV laser activation and Cu ELP. The amount of ZnO NPs within 3DP-ZnO was precisely controlled to balance the photocuring behavior and ELP efficiency. The patterned Cu showed good electrical performance with an electrical resistivity of 6.47 ± 0.22 × 10 −6 Ω•cm. Furthermore, the strong adhesion between the Cu layers and surface of the 3D printed structure was confirmed via an adhesion test. This study offers a universal and cost-effective approach for extending 3D printing applications and using 3D printing technology to create practical tools for customized electronic devices.

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New Process for Selective Additive Metallization of Alumina Ceramic Substrates

Cited by 13 publications

References 19 publications

Autocatalytic Laser Activator for Both UV and NIR Lasers: Preparation of Circuits on Polymer Substrates by Selective Metallization

Autocatalytic Laser Activator for Both UV and NIR Lasers: Preparation of Circuits on Polymer Substrates by Selective Metallization

Research on laser-assisted selective metallization of a 3D printed ceramic surface

Photocurable Three-Dimensional Printing Resin to Enable Laser-Assisted Selective Electroless Metallization for Customized Electronics

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