New Type Thermal Printing Head Using Thin Film

Shibata, Susumu; Murasugi, Keiko; Kaminishi, Katsuji

doi:10.1109/tphp.1976.1135137

“…Recently it is utilized as diffusion barrier layers for Cu wiring of Si semiconductor devices due to the excellent thermal stability [37]. It is also applied as high-speed thermal printing head [38] and thin film resistors [39]. At 0 K, VN, NbN and TaN with cubic B1 structure are dynamical instable [40].…”

Section: Binary Nitridesmentioning

confidence: 99%

Properties of multilayered and multicomponent nitride alloys from first principles

Wang¹

2018

Linköping Studies in Science and Technology. Dissertations

0

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This thesis is a theoretical exploration of properties of multilayered and multicomponent nitride alloys, in particular their mixing thermodynamics and elastic behaviors. Systematic investigation of properties of a large class of materials, such as the multicomponent nitride solid solutions, is in line with the modern approach of high-throughput search of novel materials. In this thesis we benchmark and utilize simple but efficient methodological frameworks in predicting mixing thermodynamics, Young's moduli distribution of multilayer alloys and the linear thermal expansion of quaternary nitride solid solutions.We demonstrate by accurate ab-initio calculations that Ti 1−x Al x N solid solution is stabilized by interfacial effects if it is coherently sandwiched between TiN layers along (001). For TiN/AlN and ZrN/AlN multilayers we show higher thermodynamic stability with semicoherent interfaces than with isostructural coherent ones.Accurate 0 Kelvin elastic constants of cubic Ti x X y Al 1−x−y N (X=Zr, Hf, Nb, V, Ta) solid solutions and their multilayers are derived and an analytic comparison of strengths and ductility are presented to reveal the potential of these materials in hard coating applications. The Young's moduli variation of the bulk materials has provided a reliable descriptor to screen the Young's moduli of coherent multilayers.The Debye model is used to reveal the high-temperature thermodynamics and spinodal decomposition of Ti x Nb y Al 1−x−y N. We show that though the effect of vibration is large on the mixing Gibbs free energy the local spinoal decomposition tendencies are not altered. A quasi-harmonic Debye model is benchmarked against results of molecular dynamics simulations in predicting the thermal expansion coefficients of Ti x X y Al 1−x−y N (X=Zr, Hf, Nb, V, Ta).v Sammanfattning Denna avhandling är en teoretisk undersökning av egenskaperna hos multilager och multikomponentlegeringar av nitrider, särskilt deras blandningstermodynamik och elastiska egenskaper. Systematiska undersökningar av egenskaperna hos en stor materialfamilj, såsom fasta lösningar av multikomponentnitrider, ligger i linje med den moderna angreppsvinkeln av massundersökningar i sökandet efter nya material. I denna avhandling utvärderar och använder vi enkla men effektiva metodologiska ramverk för att förutsäga blandningstermodynamik, fördelning av Young's moduli multilager och den linjära termiska expansionen i kvaternära fasta lösningar av nitrider.Vi visar med precisa ab-initio-beräkningar att en fast lösning av Ti 1−x Al x N stabiliseras av gränssnittseffekter om den placeras koherent mellan TiN-skikt längs med (001). För multilager av TiN/AlN och ZrN/AlN påvisar vi högre termodynamisk stabilitet med semikoherenta gränsskikt än med isostrukturella koherenta. Precisa elastiska konstanter vid 0 K för kubiska fasta lösningar av Ti x X y Al 1−x−y N (X=Zr, Hf, Nb, V, Ta) och deras multilager beräknas och en analytisk jämförelse av deras hållfasthet och duktilitet presenteras för att visa dessa materials potential ...

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“…Protective layers are chosen from materials such as SiO 2 , Ta 2 O 5 [88,89], or SiC [89]. For reliability, the wear life of a protective layer must exceed the cycle life of the resistor and other head parts.…”

Section: Thermal Print Transducersmentioning

confidence: 99%

“…The resistor elements are chosen from materials such as Ta 2 N [88,94], Ta -SiC [90], Zr -N [91], Ta -SiO 2 , Cr -Si -O, Si-Ta [93], Ni -Cr, and Ta -Al. Thermal insulating layers can be glass or Al 2 O 3 [93], and conductors are usually NiCr -Au [88] or Ni -Au [86].…”

Section: Thermal Print Transducersmentioning

confidence: 99%

See 1 more Smart Citation

Imaging Technology, 2. Copying and Nonimpact Printing Processes

Pai

¹

,

Melnyk

²

,

Hann³

et al. 2011

Ullmann's Encyclopedia of Industrial Chemistry

0

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The article contains sections titled: 1. Office Copying and Printing 1.1. Electrophotography 1.1.1. Photoreceptor 1.1.2. Corotron Charging 1.1.3. Light Exposure 1.1.4. Image Development 1.1.5. Image Transfer and Fusing 1.1.6. Photoreceptor Cleaning and Erase 1.1.7. Other Electrophotographic Imaging Systems 1.2. Thermographic Printing 1.2.1. Thermal Print Transducers 1.2.2. Resistive Ribbon Technology 1.2.3. Imaging Materials and Mechanisms 1.2.4. Comparison of Thermal Technologies 1.3. Ink‐Jet Printing 1.3.1. Continuous Ink Jet 1.3.2. Impulse (Drop‐on‐Demand) Ink Jet 1.3.3. Ink‐Jet Nozzle Orifice 1.3.4. Ink‐Jet Inks 1.3.5. Colorants Used in Ink Jet Inks 1.3.6. Color Printing with Ink Jets 2. Technical Copying 2.1. Diazotyping 2.1.1. Photolysis 2.1.2. Coupling Reaction 2.1.3. Production of Diazotyping Material 2.1.4. Processing 2.2. Other Photochemical Systems 2.3. Silver Process 2.3.1. Black and White Copying Materials Based on Silver Diffusion Transfer Technology 2.3.2. Modern Lithographic Printing Applications 2.3.3. Color‐Copying Materials Based on Dye Diffusion Chemistry 3. Microfilms and Microfiches 3.1. Diazotyping 3.2. Vesicular Film

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“…In mechanical industry applications, TaN has effectively been employed in devising thermal printing heads of facsimile (Fax) machines and as corrosion and wear resistant material [11][12][13]. In electronics industry, a great interest has been shown in using TaN as thin film diffusion barrier between silicon and metallic layers of Ni [14], Al [15] and Cu [16,17].…”

Section: Introductionmentioning

confidence: 99%

Growth and Study of Plasma Assisted Nanostructured Hard Tantalum Nitride Thin Films

Siddiqui

¹

,

Hussain

²

,

Ahmad

³

et al. 2015

J Fusion Energ

8

0

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Plasma assisted growth of tantalum nitride films in Mather type dense plasma focus device is reported in the current research. Effects of variation in number of plasma focus shots on structural, compositional and mechanical characteristics of synthesized tantalum nitride thin films have been investigated. Better crystallinity with thermally assisted coagulated growth patterns are observed for films synthesized by maximum (fifteen) plasma focus shots. Nano-hardness of films is observed to increase with increasing plasma focus shots whereas the maximum nanohardness of 16.24 ± 01.54 GPa is observed for film synthesized with fifteen plasma focus shots. Film roughness investigated by atomic force microscopy revealed influence of variation in plasma focus shots on surface roughness which is found to be increased with increase in plasma focus shots.

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New Type Thermal Printing Head Using Thin Film

Cited by 25 publications

References 4 publications

Properties of multilayered and multicomponent nitride alloys from first principles

Properties of multilayered and multicomponent nitride alloys from first principles

Imaging Technology, 2. Copying and Nonimpact Printing Processes

Growth and Study of Plasma Assisted Nanostructured Hard Tantalum Nitride Thin Films

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