2015
DOI: 10.1038/srep08288
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Next Generation Device Grade Silicon-Germanium on Insulator

Abstract: High quality single crystal silicon-germanium-on-insulator has the potential to facilitate the next generation of photonic and electronic devices. Using a rapid melt growth technique we engineer tailored single crystal silicon-germanium-on-insulator structures with near constant composition over large areas. The proposed structures avoid the problem of laterally graded SiGe compositions, caused by preferential Si rich solid formation, encountered in straight SiGe wires by providing radiating elements distribut… Show more

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Cited by 53 publications
(40 citation statements)
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“…3a) are clearly delineated by abrupt orientation changes in the dendrites and regions of high-germanium content that solidify at the termination of each grain. The latter are similar to the Ge-rich terminal caps in nanowires51 and microencapsulated SiGe films30. The orientation of an unusually long dendrite can be seen to vary several degrees over a length of ∼1 mm.…”
Section: Resultsmentioning
confidence: 59%
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“…3a) are clearly delineated by abrupt orientation changes in the dendrites and regions of high-germanium content that solidify at the termination of each grain. The latter are similar to the Ge-rich terminal caps in nanowires51 and microencapsulated SiGe films30. The orientation of an unusually long dendrite can be seen to vary several degrees over a length of ∼1 mm.…”
Section: Resultsmentioning
confidence: 59%
“…This would permit direct integration of high-mobility circuit elements30 with minimal germanium concentration gradients and reduced heating of the wafer, in a two-dimensional equivalent of our process.…”
Section: Discussionmentioning
confidence: 99%
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“…As a result, components of the core intermix during fiber drawing or breakup, and the initial core structure is lost. Another route needs to be used to go beyond those limitations.The solidification of SiGe and pure silicon and germanium has been the subject of a large number of studies in different types of configurations and geometries (16)(17)(18)(19)(20). First of all, both the alloy and pure materials are known to expand upon solidification, owing to their diamond cubic structure, such that constrained solidification should be associated with pressure buildup.…”
mentioning
confidence: 99%
“…An ultrathin SiGe-on-insulator (SGOI) layer is essential to fabricate the SiGe nanowire by lithographic technology. In the field of ULSI devices, such as a metal-oxide-semiconductor transistor, there are a variety of fabrication methods of single-crystalline SiGe (sc-SiGe) thin film grown on SiO 2 /Si substrates [24][25][26][27][28][29][30][31][32]. Most of them are difficult and costly since their process is complicated and is not fit for a large-area formation.…”
Section: Introductionmentioning
confidence: 99%