Ni and Ni alloy coatings electrodeposited from choline chloride‐based ionic liquids—electrochemical synthesis and characterization

Florea, Andreea; Anicăi, Liana; Costovici, Stefania; Golgovici, Florentina; Visan, Teodor

doi:10.1002/sia.3317

Cited by 56 publications

(44 citation statements)

References 7 publications

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“…Similarly, the electrodeposition of NiCo alloy in ChCl/EG (1:2 molar ratio) also does not follow the anomalous codeposition process frequently observed in aqueous solutions . NiSn alloys can also be fabricated from ChCl/EG (1:2 molar ratio) and ChCl/urea (1:2 molar ratio) DESs . As expected, the nature of DESs produced an influence on the properties of NiSn alloys, with better deposits obtained from ChCl/EG (1:2 molar ratio).…”

Section: Direct Electrodeposition From Ilssupporting

confidence: 60%

Electrodeposition in Ionic Liquids

et al. 2015

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Due to their attractive physico-chemical properties, ionic liquids (ILs) are increasingly used as deposition electrolytes. This review summarizes recent advances in electrodeposition in ILs and focuses on its similarities and differences with that in aqueous solutions. The electrodeposition in ILs is divided into direct and template-assisted deposition. We detail the direct deposition of metals, alloys and semiconductors in five types of ILs, including halometallate ILs, air- and water-stable ILs, deep eutectic solvents (DESs), ILs with metal-containing cations, and protic ILs. Template-assisted deposition of nanostructures and macroporous structures in ILs is also presented. The effects of modulating factors such as deposition conditions (current density, current density mode, deposition time, temperature) and electrolyte components (cation, anion, metal salts, additives, water content) on the morphology, compositions, microstructures and properties of the prepared materials are highlighted.

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Section: Direct Electrodeposition From Ilssupporting

confidence: 60%

Electrodeposition in Ionic Liquids

et al. 2015

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“…It has been shown recently that it is possible to create an ionic fluid mixing quaternary ammonium halides with an amide, carboxylic acid or alcohol moiety [20][21][22][23]. Such mixtures are not, strictly speaking, room-temperature ionic liquids (RTIL) since in general contain an uncharged molecular component, so that, the term Deep Eutectic Solvent (DES) was coined by Abbott [24].…”

Section: Introductionmentioning

confidence: 98%

Electrodeposition of Co, Sm and SmCo from a Deep Eutectic Solvent

Gómez

Cojocaru

Magagnin

et al. 2011

Journal of Electroanalytical Chemistry

170

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“…In the case of nickel, different structures were found depending on both the DES composition and substrates employed. [38][39][40][41][42][43][44][45][46][47] Recently, Ustarroz et al investigated the nickel deposition on glassy carbon using a ChCl/urea based DES and described that nickel deposition involved the formation of nanostructures. 48 Here, we investigated in detail the electrodeposition of nickel in a DES based on the mixture ChCl/urea.…”

mentioning

confidence: 99%

Surface Sensitive Nickel Electrodeposition in Deep Eutectic Solvent

Sebastián

Giannotti

Gómez

et al. 2018

ACS Appl. Energy Mater.

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The first steps of nickel electrodeposition in a deep eutectic solvent (DES) are analysed in detail. Several substrates from glassy carbon to Pt(111) were investigated pointing out the surface sensitivity of the nucleation and growth mechanism. For that, cyclic voltammetry and chronoamperometry, in combination with scanning electron microscopy (SEM), were employed. X-ray diffraction (XRD) and atomic force microscopy (AFM) were used to more deeply analyse the Ni deposition on Pt substrates.In a 0.1 M NiCl 2 + DES solution (at 70ºC), the nickel deposition on glassy carbon takes place within the potential limits of the electrode in the blank solution. Although, the electrochemical window of Pt|DES is considerably shorter than on glassy carbon|DES, it was still sufficient for the nickel deposition. On Pt electrode, the negative potential limit was enlarged while the nickel deposit growed, likely because of the lower catalytic activity of the nickel towards the reduction of the DES. At lower overpotentials, different hydrogenated Ni structures were favoured, most likely because of the DES co-reduction on the Pt substrate. Nanometric metallic nickel grains of rounded shape were obtained in any substrate, as evidenced by the FE-SEM. Passivation phenomena, related to the formation of Ni oxide and Ni hydroxylated species, were observed at high applied overpotentials. At low deposited charge, on Pt(111) the AFM measurements showed the formation of rounded nanometric particles of Ni, which rearranged and formed small triangular arrays at sufficiently low applied overpotential (Scheme 1). This particle pattern was induced by the <111> orientation and related to surface sensitivity of the nickel deposition in DES. The present work provides deep insights into the Ni electrodeposition mechanism in the selected deep eutectic solvent. Scheme 1. Representation of the Ni(II) electrodeposition in DES on Pt(111) and AFM image (2 x 2 µm 2 ) of the Ni clusters.

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Ni and Ni alloy coatings electrodeposited from choline chloride‐based ionic liquids—electrochemical synthesis and characterization

Cited by 56 publications

References 7 publications

Electrodeposition in Ionic Liquids

Electrodeposition in Ionic Liquids

Electrodeposition of Co, Sm and SmCo from a Deep Eutectic Solvent

Surface Sensitive Nickel Electrodeposition in Deep Eutectic Solvent

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