wireless power transfer, [6] stretchable electromagnetic actuator, [7] and stretchable loudspeaker. [8] To date, various fabrication techniques have been applied to pattern the liquid metals on flexible substrates, such as microchannel injection, [9] atomized spraying deposition, [10] imprinting, [11] microcontact printing, [12] direct writing, [13] masked deposition, [14] direct laser patterning, [15] Cu transfer-printing, [16] phase transition dual-trans printing, [17] and liquid metal droplet printing. [18][19][20] Although the currently available current printing techniques can achieve good control to some extent, it is worth noting that the printed substrates are usually limited to polymer-based materials because of the extremely large surface tension of EGaIn. With the explosive research and application of liquid metal electronics, developing a universal printing method to resolve the challenging tough wettability issues was put to an ever higher level from both academic aspect and industrial demand.To improve the wettability and adhesion between LMs and substrate, one strategy is to develop functional LM materials. For example, Tang et al. introduced liquid metal alloys with Cu particles to significantly enhance its electroconductivity and adhesion for directly writing soft electronics on papers and polyvinyl chloride (PVC) substrates. [21] Chang et al. developed GaIn-Ni amalgams to improve affinity of LMs with various substrates, such as paper, polydimethylsiloxane (PDMS), and polyethylene terephthalate (PET). [22] However, all these functional LM materials exhibit low liquidity and high viscosity, which may limit their direct printing capability with high resolution and rapid manufacture. Clearly, the underlying mechanism is rooted As soft conductive materials with high liquid fluidity, the room-temperature liquid metal alloys (LMs) offer a superior alternative to the fabrication of flexible electronics. So far, techniques aiming at patterning LMs are seriously limited by the alloy's high surface tension and poor wettability with many substrates. Additionally, LMs based mass production with fast and efficient printing on desired target still encounters tremendous unsolved challenges. Here, a one-step liquid metal transfer printing method with wide range substrate adaptability, comprising of polymer-based adhesive glue, its printing machine, the LMs ink, and the soft substrate is presented. It is demonstrated that even on those substrates with weak wettability to LMs, the liquid metal transfer printing still works well to create complex conductive geometries, multilayer circuits, and large-area conductive patterns with excellent transfer efficiency, facile fabrication process, and remarkable electrical stability, which is beneficial to quickly construct wearable electronics, 3D folding conductive structures, flexible actuators, soft robots, etc. Moreover, its advantages of self-healing and recyclable ability make the strategy possible to prepare reconfigurable circuits and further reduce the cost of fabri...