“…With the widespread use of electronic communication equipment, increasingly prominent electromagnetic radiation and electromagnetic interference (EMI) shielding seriously interrupts the operation of the equipment and even damages human health. − Traditional EMI shielding materials mainly include metal and conductive polymer composites (CPCs). − However, there are plenty of limitations in the use of metals due to their high density, high cost, low corrosion resistance, and poor molding processability. , Moreover, metals are prone to secondary pollution of electromagnetic waves due to higher electromagnetic wave reflectivity. , CPCs have excellent molding processability, low cost, low density, corrosion resistance, and other advantages, which are expected to partially replace traditional metal EMI shielding materials. , However, CPCs usually require a high content of conductive fillers, which deteriorates their mechanical properties and are difficult to adapt to applications in harsh environments, such as high-altitude aircraft, aerospace, manned spacecraft, and marine vehicles. , The EMI shielding materials used in these occasions should not only have excellent EMI shielding performance, but also sufficient mechanical properties and excellent oxidation resistance. , Therefore, ceramic-based composites containing conductive fillers have great potential to be the next-generation EMI shielding materials. , …”