2020
DOI: 10.1016/j.talanta.2020.120891
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NiO@Ni-MOF nanoarrays modified Ti mesh as ultrasensitive electrochemical sensing platform for luteolin detection

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Cited by 66 publications
(26 citation statements)
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“…The bands below 1000 cm −1 (e.g., 600 and 694 cm −1 ) were attributed to the interatomic vibrations of Ni− O. 25,31 NiO/Ni-MOFs had analogous FTIR peaks to Ni-MOF, reflecting that Ni-MOF succeeded in growing from NiO. Three small peaks between 3200 and 3600 cm −1 associated with the O−H stretching vibration suggested the diversity of OH that existed in the samples.…”
Section: Resultsmentioning
confidence: 97%
“…The bands below 1000 cm −1 (e.g., 600 and 694 cm −1 ) were attributed to the interatomic vibrations of Ni− O. 25,31 NiO/Ni-MOFs had analogous FTIR peaks to Ni-MOF, reflecting that Ni-MOF succeeded in growing from NiO. Three small peaks between 3200 and 3600 cm −1 associated with the O−H stretching vibration suggested the diversity of OH that existed in the samples.…”
Section: Resultsmentioning
confidence: 97%
“…Regarding to the LOD, the work reported by Fu and Liu et al reaching 1.7 pM, 87 together with the articles published by Dong and Guo et al, what reaches concentration of 3.3 pM, 88 and the work of Qu and Lu et al obtaining a LOD value of 3 pM, 89 are the most promising in the field. It is noteworthy, in the case of these last two studies, in addition to extremely low detection limits, they achieve the measurement in a very short time, 60 s and 30 s, respectively.…”
Section: Electrochemical Determinationsmentioning
confidence: 94%
“…Regarding to the LOD, the work reported by Fu and Liu et al reaching 1.7 pM, 87 89 are the most promising in the field. It is noteworthy, in the case of these last two studies, in addition to extremely low detection limits, they achieve the measurement in a very short time, 60 s and 30 s, respectively.…”
Section: Electrochemical Determinationsmentioning
confidence: 99%
“…Different combinations of transmittance and conductivity can be customized by adjusting line widths and spacing. The current preparation processes mainly include the heat treatment method [62], template method [63], lithography [64], imprinting [65], and laser pulse etching [66]. In order for them to be commercially available, it is necessary to find a high-throughput and low-cost preparation process.…”
Section: Metal Meshmentioning
confidence: 99%