Nitrite effects on copper corrosion in nitric acid solutions

Particle-particle interface corrosion of cold sprayed copper in dilute nitric acid solution: Geometry-controlled corrosion mechanism

“…This suggests that a corrosion process was involved in causing the damage to the Cu matrix surrounding PPIs. We propose a corrosion mechanism that accounts for PPI corrosion on CS Cu which incorporates the Cu-Cu + -NO3 − -NO2 − and Cu-Cu + -Cu 2+ cataly�c corrosion cycles reported previously on the O-free Cu [18][19][20].…”

“…While NO2 − is known to be unstable in acidic solu�ons and decompose via reac�ons ( 5) and ( 6) [20],…”

“…Despite most studies' revealing unremarkable to marginally increased corrosion damage at the PPIs [13][14][15][16], a recent study [17] showed that CS Cu, a candidate for the corrosion-resistant coa�ng of Canadian-designed used nuclear fuel containers (UFCs) [17], exhibited higher degree of reac�vity at the PPIs when exposed to naturally aerated dilute nitric acid (HNO3) solu�on [18]; however, the exact corrosion mechanism was not inves�gated. Previous studies have shown that dissolved oxygen is paramount in the corrosion of the wrought Cu in dilute HNO3 solu�ons [19][20][21]. Therefore, in this work, corrosion behaviour of CS Cu was assessed in dilute HNO3 solu�ons with various oxygen content.…”

Effect of refrigerant absorbent combinations in the corrosion resistance of copper as structural material in absorption refrigeration systems (ARS)

“…Figure 2(a) shows that copper immersed in S 1 solution got the more active potential during the first seconds (from 0 to 1000 s) with a E OCP of −310 ± 16 mV, decreasing gradually until −320 ± 10 mV. In the presence of LiNO 3 (S 2 solution), E OCP of copper is displaced to less active potentials, registering a value of −245 ± 14 mV shifted throughout the time toward more active potential (−263 ± 9 mV), suggesting the formation of a layer of corrosion products, compounded by CuO and Cu 2 O [14–16] due to the presence of normalNnormalO3− [17] and copper oxidation in Cu + and Cu −2 ion promoting due that the normalNnormalO3−act as a cathodic reagent that produces normalNnormalO2− via: Then the NO2− is converted into nitrous oxide and oxygen ions as it was described by Rizvi et al as follows [18]: The latter allowed the formation of a stable passive film of CuO and Cu(OH) 2 .

Figure 2 OCP behaviour for the copper immersed in S 1 , S 2 , S3 and S 4 solutions at 25, 50 and 80°C.

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“…Figure 2(a) shows that copper immersed in S 1 solution got the more active potential during the first seconds (from 0 to 1000 s) with a E OCP of −310 ± 16 mV, decreasing gradually until −320 ± 10 mV. In the presence of LiNO 3 (S 2 solution), E OCP of copper is displaced to less active potentials, registering a value of −245 ± 14 mV shifted throughout the time toward more active potential (−263 ± 9 mV), suggesting the formation of a layer of corrosion products, compounded by CuO and Cu 2 O [14][15][16] due to the presence of NO − 3 [17] and copper oxidation in Cu + and Cu −2 ion promoting due that the NO − 3 act as a cathodic reagent that produces NO − 2 via:…”