The damage generated in wurtzite nitride semiconductors (AlN, GaN, and InN) by 300 keV rare earth ions has been studied following implantation at room temperature of Eu from 1012 to above 1017 ions/cm2. X-ray diffraction (XRD), transmission electron microscopy (TEM) and Rutherford backscattering (RBS) were used to investigate the evolution of damage and the deformation mechanisms versus the fluence. The behavior of the three compounds is clearly different; whereas InN breaks down at low fluences (∼1012 ions/cm2), it is shown that the damage formation mechanisms are similar in AlN and GaN. In both compounds, extended defects such as stacking faults play a critical role but exhibit different stability, as a consequence, GaN transforms to nanocrystalline state from the surface at a fluence of around 2.5×1015 ions/cm2. In contrast, AlN amorphizes starting at the projected range (R
p), when the fluence exceeds 1017 ions/cm2.