No-clean polymer flux evaluations and its impact on BGA solder joint quality and board level reliability

Serene, Lee Choon Mei; Marbella, Carlo; Min, Tan Ai

doi:10.1109/iemt.2010.5746688

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No-clean polymer flux evaluations and its impact on BGA solder joint quality and board level reliability

Cited by 3 publications

References 1 publication

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Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP

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