1989
DOI: 10.1080/00018738900101122
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Noise in solid-state microstructures: A new perspective on individual defects, interface states and low-frequency (1/ƒ) noise

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Cited by 1,206 publications
(741 citation statements)
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“…some surely arise from conformational changes and steric effects.) Rectangular currents are known to arise when ions jump onto binding sites in insulating regions of field effect transistors (Kirton & Uren, 1989) and similar currents occur in ‗Coulomb blockade' (Grabert & Devoret, 1992). If a tiny (0.1%) time independent conformation change is put into a time dependent version of the PNP equations, currents are computed that turn on and off as channel currents do (Gardner, Jerome & Eisenberg, 1998).…”
Section: Brief History Of Diffusion Theory Of Chemical Reactions Thementioning
confidence: 99%
“…some surely arise from conformational changes and steric effects.) Rectangular currents are known to arise when ions jump onto binding sites in insulating regions of field effect transistors (Kirton & Uren, 1989) and similar currents occur in ‗Coulomb blockade' (Grabert & Devoret, 1992). If a tiny (0.1%) time independent conformation change is put into a time dependent version of the PNP equations, currents are computed that turn on and off as channel currents do (Gardner, Jerome & Eisenberg, 1998).…”
Section: Brief History Of Diffusion Theory Of Chemical Reactions Thementioning
confidence: 99%
“…Power spectrum current noise in MOSFETs at low frequency follows the 1/f law, meaning that the noise spectrum is inversely proportional to frequency f on a logarithm scale. The 1/f noise is generally interpreted as the superposition of random events of charge trapping and de-trapping from defects randomly distributed in the gate oxide (for example, SiO 2 ) near the semiconductor channel (for example, Si) 2,3 (Fig. 1a).…”
mentioning
confidence: 99%
“…Fabricating CMOS devices in SOI presents challenges in device design and process integration, as well as in the process simulation, device simulation and circuit simulation TCAD tools. For [81,17,65] example, dopant diffusion in the thin silicon layer over the BOX is dramatically altered in SOI by interaction of the diffusing dopants with the silicon/BOX interface (at the top of the BOX) [104,46,66]. This and other differences must be comprehended in process simulations and in process integration for IC fabrication.…”
Section: Soi Challenges and Issuesmentioning
confidence: 99%