2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference 2011
DOI: 10.1109/asmc.2011.5898208
|View full text |Cite
|
Sign up to set email alerts
|

Non-contact handling and transportation for substrates and microassembly using ultrasound-air-film-technology

Abstract: The requirements needing to be met by handling technologies and factory automation in semiconductor fabrication and microsystem s technology are rising relentlessly. Fragile, surface -sensitive and thinned substrates call for new, innovative approaches in order to tackle numerous material handling tasks. Therefore a new upcoming handling technology based on the ultrasound -air-film-technology and its applications for non -contact handling in PV -Thin-Film and microassembly are presented in this paper.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
9
0

Year Published

2015
2015
2024
2024

Publication Types

Select...
4
1
1

Relationship

0
6

Authors

Journals

citations
Cited by 10 publications
(9 citation statements)
references
References 7 publications
0
9
0
Order By: Relevance
“…Implemented industrial applications cover a large range of sizes from end effectors for wafer and parts pick-and-place to the handling of large and thin substrates such as flat panel displays, photovoltaic cells, etc. [8,10,37,38] (see for example ZS-Handling products 3 ). In addition to levitation, a planar object can be transported by a flexural traveling wave [11,39].…”
Section: Ultrasound Bearing Surfacesmentioning
confidence: 99%
See 2 more Smart Citations
“…Implemented industrial applications cover a large range of sizes from end effectors for wafer and parts pick-and-place to the handling of large and thin substrates such as flat panel displays, photovoltaic cells, etc. [8,10,37,38] (see for example ZS-Handling products 3 ). In addition to levitation, a planar object can be transported by a flexural traveling wave [11,39].…”
Section: Ultrasound Bearing Surfacesmentioning
confidence: 99%
“…For example, end effectors such as semiconductor wafer handlers have side stops to prevent the substrate from sliding off the gripper [9]. Micro-grippers and top-side handling systems use vacuum nozzles for self-centering and producing attraction forces [10].…”
Section: Ultrasound Bearing Surfacesmentioning
confidence: 99%
See 1 more Smart Citation
“…8 Also, fluid dynamics have been studied by acoustic levitation, [10][11][12][13][14] which can measure the liquid surface tension, observe the steadystate acoustic streaming flow patterns, 11 and carry out mass transfer in the surface of sphere by acoustic streaming. 12 Acoustic levitation has been used in assembly as well, [15][16][17] even small living animals could be levitated by acoustic method. 18 However, most of the previous research were working with fixed levitation platform, at which the objects movement is difficult to be controlled.…”
Section: Introductionmentioning
confidence: 99%
“…For instance, air bearings are widely used to transport large, thin and heavy products like glass and LCD panels [5]. Instead of pressurized air fed through orifice or porous media, ultrasound bearings can also be used to lift a substrate over a vibrating plate [6], [7], [8], [9]. But air bearing and vibrating tables realize only the levitation of product, the motion is still achieved by another principle (gravity, wheels, belt conveyors).…”
Section: Introductionmentioning
confidence: 99%