2019
DOI: 10.1016/j.surfcoat.2018.12.123
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Non-contact residual stress analysis method with displacement measurements in the nanometric range by laser made material removal and SLM based beam conditioning on ceramic coatings

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Cited by 8 publications
(4 citation statements)
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“…Due to the large temperature gradients and high-frequency heating-cooling cycles during the manufacturing process, it is difficult to monitor the temperature and thermal stress in real time during experiments. For the residual stress measurement, the experimental approaches, such as the neutron diffraction [16,17], X-ray diffraction [18], contour method [19] and semi-destructive hole drilling method [20,21], are costly and sometimes limited to surface measurements. Numerical simulations are efficient to study the mechanical behaviours during the manufacturing process [22].…”
Section: Introductionmentioning
confidence: 99%
“…Due to the large temperature gradients and high-frequency heating-cooling cycles during the manufacturing process, it is difficult to monitor the temperature and thermal stress in real time during experiments. For the residual stress measurement, the experimental approaches, such as the neutron diffraction [16,17], X-ray diffraction [18], contour method [19] and semi-destructive hole drilling method [20,21], are costly and sometimes limited to surface measurements. Numerical simulations are efficient to study the mechanical behaviours during the manufacturing process [22].…”
Section: Introductionmentioning
confidence: 99%
“…Due to the large temperature gradients and high-frequency heating/cooling cycles during the manufacturing process, it is difficult to monitor the temperature and thermal stress in real time during experiments. For the residual stress measurement, the experimental approaches, such as the neutron diffraction [11], X-ray diffraction [12], contour method [13] and semi-destructive hole drilling method [14,15], are costly and sometimes limited to surface measurements. Numerical simulations are efficient to study the mechanical behaviour during the manufacturing process.…”
Section: Introductionmentioning
confidence: 99%
“…Optical interferometric techniques are widely used for residual stress analyses in conjunction with semi-destructive techniques such as the sectioning, hole drilling, and contour methods. [5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20]. In these methods, the material around a residually stressed area is removed step by step.…”
Section: Introductionmentioning
confidence: 99%
“…At each step, the displacement resulting from the last material removal is measured with the optical interferometry. Some authors use digital holography [7][8][9] and other use ESPI [10][11][12][13][14][15][16][17][18] for the optical technique. Recent studies report non-contact methods to relieve the residual stress using laser ablation [9] or laser annealing [18].…”
Section: Introductionmentioning
confidence: 99%