Non-destructive evaluation methods for subsurface damage in silicon wafers: a literature review

Lu, W. K.; Pei, Zhijian; Sun, Jichao

doi:10.1504/ijmmm.2007.012672

Cited by 14 publications

(11 citation statements)

References 29 publications

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“…The X-ray diffraction (XRD) method is used to measure the machining-induced stress in the semiconductor materials [23,85]. Generally, the diffraction spectrum is narrow and sharp if a sample does not have residual stresses; otherwise, the spectrum is broadened with diffraction peaks shifted.…”

Section: Other Methodsmentioning

confidence: 99%

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Methods for Detection of Subsurface Damage: A Review

Yin

Bai

2018

Chin. J. Mech. Eng.

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Subsurface damage is easily induced in machining of hard and brittle materials because of their particular mechanical and physical properties. It is detrimental to the strength, performance and lifetime of a machined part. To manufacture a high quality part, it is necessary to detect and remove the machining induced subsurface damage by the subsequent processes. However, subsurface damage is often covered with a smearing layer generated in a machining process, it is rather difficult to directly observe and detect by optical microscopy. An efficient detection of subsurface damage directly leads to quality improvement and time saving for machining of hard and brittle materials. This paper presents a review of the methods for detection of subsurface damage, both destructive and non-destructive. Although more reliable, destructive methods are typically time-consuming and confined to local damage information. Non-destructive methods usually suffer from uncertainty factors, but may provide global information on subsurface damage distribution. These methods are promising because they can provide a capacity of rapid scan and detection of subsurface damage in spatial distribution.

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Section: Other Methodsmentioning

confidence: 99%

“…The Argonne National Laboratory and the Kansas State University jointly developed the cross-polarization confocal microscopy (CPCM) to measure SSD in the ground ceramics and silicon wafers [5,15,[85][86][87][88][89][90][91][92]. As shown in Figure 8, an incident light is linearly polarized and hits the surface of a sample.…”

Section: Laser Scatteringmentioning

confidence: 99%

Methods for Detection of Subsurface Damage: A Review

Yin

Bai

2018

Chin. J. Mech. Eng.

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“…Numerous methods have been used by various investigators to measure surface damage in silicon wafers [Lu et al 2007]. These methods include cross-sectional microscopy, scanning electron microscopy, ultrasonic measurement, optical scattering method, X-ray topography, and scanning infrared depolarization (SIRD).…”

Section: Subsurface Damagementioning

confidence: 99%

Simultaneous Double-Side Grinding of Silicon Wafers: A Review and Analysis of Experimental Investigations

Qin

Pei

Fisher

et al. 2009

Machining Science and Technology

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Simultaneous double side grinding (SDSG) has become an important flattening process for manufacturing of 300 mm silicon wafers. However, the literature contains only a small number of papers on SDSG. In contrast, there are a large number of patents pertinent to this process. There is no review paper summarizing all these reported experimental results. This paper reviews the literature on experimental investigations on SDSG of silicon wafers. It first describes input variables in SDSG, and then presents their effects on output variables, covering warp, flatness, surface roughness, nanotopography, wafer-thickness variation, rotational asymmetry, grinding marks, subsurface damage, wheel wear, and process cycle time. It also discusses the definition, * Corresponding author.

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“…Silicon wafers are presently used in ϳ90% of microelectronic devices, and therefore NDE of this material is of great practical interest. 32 Especially the detection of subsurface defects such as voids or bubbles is a difficult task in comparison with surface-breaking cracks. The main drawback of the LIFU method is the contact of one side of the sample with water.…”

Section: Experiments With Silicon Wafersmentioning

confidence: 99%

Laser-induced focused ultrasound for nondestructive testing and evaluation

Kozhushko

Hess

2008

Journal of Applied Physics

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Focused ultrasound pulses generated by photoacoustic transformation at a metal surface immersed in water possess a pronounced compression phase on the nanosecond time scale. For 8 ns laser pump pulses, the spectrum of the initially generated ultrasonic pulse covered a frequency range between 0.1 and 150 MHz. A concave spherical geometry of the light-absorbing metal surface can be used to achieve focusing. In the present experiments a conical ultrasound beam was directed at a solid glass plate or silicon wafer, where the tilt of the normal of the metal mirror defined the efficiency of mode conversion at the water-solid interface. Depending on the configuration, focused bulk waves as well as Rayleigh and Lamb waves could be launched in the sample with this setup. The laser probe-beam-deflection method was employed for local detection of elastic disturbances at the sample surface. Due to the nonlinear elastic response of water and harmonics generation, frequencies >100 MHz were realized, despite a strong attenuation in this frequency range. Gradual increase of the laser power density from 5 to 14 MW/cm2 led to shock formation in the compressive pressure pulse in water and shortening of the Rayleigh pulse induced at the surface of the glass plate. The observed transient surface profiles were highly sensitive to nearby mechanical discontinuities such as a microcrack in glass or an edge discontinuity in silicon. Therefore, laser-induced focused ultrasound seems to be a very promising method of accomplishing diverse tasks of nondestructive evaluation.

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Non-destructive evaluation methods for subsurface damage in silicon wafers: a literature review

Cited by 14 publications

References 29 publications

Methods for Detection of Subsurface Damage: A Review

Methods for Detection of Subsurface Damage: A Review

Simultaneous Double-Side Grinding of Silicon Wafers: A Review and Analysis of Experimental Investigations

Laser-induced focused ultrasound for nondestructive testing and evaluation

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