Non-sintering Preparation of Copper (II) Oxide Powder for Electroplating via 2-step Chemical Reaction

Abstract

In this study, copper (II) oxide was prepared for use in a copper electroplating solution. Copper chloride powder and copper (II) oxide are widely used as raw materials for electroplating. Copper (II) oxide was synthesized in this study using a twostep chemical reaction. Herein, we developed a method for the preparation of copper (II) oxide without the use of sintering. In the first step, copper carbonate was prepared without sintering, and then copper (II) oxide was synthesized without sintering using sodium hydroxide. The optimum amount of sodium hydroxide used for this process was 120 g and the optimum reaction temperature was 120 o C regardless of the starting material.

Manufacturing of Copper(II) Oxide Powder for Electroplating from NaClO3 Type Etching Wastes

“…In the first step reaction, basic copper carbonate [mCuCO 3 ·nCu(OH) 2 ] was prepared by reacting copper chloride with sodium carbonate (Na 2 CO 3 99 wt.%, product of OCI) as shown in equations (1) and (2). The first reaction product of copper (II) oxide was prepared by reacting alkali copper carbonate with sodium hydroxide (NaOH, 99 wt.%, product of OCI) shown at the second reaction step as shown in equation (3) [9][10].…”

“…Via-filling plating analysis was performed using a Harring cell electrolyzer [9]. To prevent corrosion of titanium, positive electrode plate coated with 1mm of iridium (IrO 2 ), which has highly corrosion resistant, was used for the insoluble anode.…”

“…The plating test results are judged based on the hole filling test that satisfies the filling of the plating on the inner wall of the hole based on the plating judgment criteria. The lower the value of the hole-filling is, the more the plating film is uniformly deposited in the hole and the quality of the plating state is evaluated to be good [9]. Fig.…”