Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF

Su, Lei; Shi, Tielin; Liu, Zhiping; Zhou, Hongdi; Du, Li; Liao, Guanglan

doi:10.1016/j.ymssp.2016.09.030

Cited by 40 publications

(13 citation statements)

References 20 publications

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“…It can be used to reduce the data dimensionality and eliminate some irregularities from the data. e reduction process is as follows [15].…”

Section: Pcamentioning

confidence: 99%

Cavitation Detection in Centrifugal Pump Based on Interior Flow‐Borne Noise Using WPD‐PCA‐RBF

Zhu

et al. 2019

Shock and Vibration

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Cavitation detection is particularly essential for operating efficiency and stability of pumps. In this work, to improve the accuracy and efficiency of identification, an approach combining wavelet packet decomposition (WPD) with principal component analysis (PCA) and radial basic function (RBF) neural network is introduced to detect the cavitation status for centrifugal pumps. The cavitation performance and interior flow-borne noise are measured under three different flow conditions. Then, time-frequency domain analysis is performed on the interior flow-borne noise signal using WPD, and the energy coefficient of each node is calculated to determine the optimal decomposition frequency band. Six-feature parameters are extracted based on frequency-division statistics, including three time-domain features and three wavelet packet features. After that, the PCA is applied for dimensionality reduction. Finally, three cavitation statuses of noncavitation, inception cavitation, and serious cavitation are identified adopting RBF neural network. The results show that the comprehensive identification rate of the proposed method for three cavitation statuses reaches 98.2% with low identification error. The method based on interior flow-borne noise analysis can be well applied for on-line monitoring and diagnosis of pump industry.

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“…It can be used to reduce the data dimensionality and eliminate some irregularities from the data. e reduction process is as follows [15].…”

Section: Pcamentioning

confidence: 99%

Cavitation Detection in Centrifugal Pump Based on Interior Flow‐Borne Noise Using WPD‐PCA‐RBF

Zhu

et al. 2019

Shock and Vibration

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“…Design flaws and defects need to be eliminated to deliver cutting-edge products with long lifetime. [1] Nondestructive methods to inspect and detect functional faults range mainly from x-ray tomography [2] to scanning acoustic microscopy, [3] surface acoustic waves, [4,5] and thermography. [6] Additionally, transient thermal analysis can be applied to detect crack propagation in solder joints.…”

Section: Introductionmentioning

confidence: 99%

Thermomechanical stress in GaN‐LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy

Liu

Conti

Bhogaraju

et al. 2020

J Raman Spectroscopy

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Local thermomechanical stress can cause failures in semiconductor packages during long-time operation under harsh environmental conditions. This study helps to explain the packaging-induced stress in blue GaN-LEDs soldered onto copper substrates using AuSn alloy as lead-free interconnect material. Based on the finite element method, a virtual prototype is developed to simulate the thermomechanical behavior and stress in the LED and in the complete LED/AuSn/Cu assembly considering plastic and viscoplastic strain. The investigations were performed by varying the temperature between −50 C and 180 C. To validate the model, the simulation results are compared to experimental data collected with Raman spectroscopy. Studies of the E H 2 phonon mode of GaN semiconductor are elaborated to understand the induced thermomechanical stress. The model enables evaluation of the stress in the interfaces of the assembly, which otherwise cannot be accessed by measurements. It serves to predict how assemblies would perform, before committing resources to build a physical prototype.

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“…For ensuring the high reliability of internal connection, effective methods for non-destructively detecting the defects of flip chip are needed. A variety of techniques including X-ray microscopy [6], laser ultrasound [7], active infrared thermal imaging [8], vibration analysis [9], and AMI (acoustic micro imaging) [10][11][12] have been proven to be available for detecting the defects of interconnections in flip chip. X-ray detection technology has been widely used in non-destructive detection of defects; however, this method requires expensive equipment, generates harmful radiation to the human body, and needs experienced operators.…”

Section: Introductionmentioning

confidence: 99%

Simulation Research on Sparse Reconstruction for Defect Signals of Flip Chip Based on High-Frequency Ultrasound

Huang

Xie

et al. 2020

Applied Sciences

Self Cite

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Flip chip technology has been widely used in various fields. As the density of the solder balls in flip chip technology is increasing, the pitch among solder balls is narrowing, and the size effect is more significant. Therefore, the micro defects of the solder balls are more difficult to detect. In order to ensure the reliability of the flip chip, it is very important to detect and evaluate the micro defects of solder balls. High-frequency ultrasonic testing technology is an effective micro-defect detection method. In this paper, the interaction mechanism between high-frequency ultrasonic pulse and micro defects is analyzed by finite element simulation. A transient simulation model for the whole process of ultrasonic scanning of micro defects is established to simulate scanning in acoustic microscopy imaging. The acoustic propagation path map is obtained for analyzing acoustic energy transmission during detection, and the edge blurring effect in micro-defect imaging detection is clarified. The processing method of the time-domain signal and cross-section image signal of micro defects based on sparse reconstruction is studied, which can effectively improve the accuracy of detection and the signal-to-noise ratio.

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Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF

Cited by 40 publications

References 20 publications

Cavitation Detection in Centrifugal Pump Based on Interior Flow‐Borne Noise Using WPD‐PCA‐RBF

Cavitation Detection in Centrifugal Pump Based on Interior Flow‐Borne Noise Using WPD‐PCA‐RBF

Thermomechanical stress in GaN‐LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy

Simulation Research on Sparse Reconstruction for Defect Signals of Flip Chip Based on High-Frequency Ultrasound

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