2017
DOI: 10.1126/sciadv.1602586
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Nondestructive imaging of atomically thin nanostructures buried in silicon

Abstract: Microwave microscopy enables three-dimensional characterization of atomically thin semiconductor structures with nanometer precision.

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Cited by 65 publications
(58 citation statements)
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“…Furthermore, scanning probe and electron microscopy techniques are exclusively surfacesensitive and thus cannot probe bulk or dilute samples. The properties of samples buried even a few nanometers below the surface can only be probed using advanced nanotomography variants (30,31).…”
mentioning
confidence: 99%
“…Furthermore, scanning probe and electron microscopy techniques are exclusively surfacesensitive and thus cannot probe bulk or dilute samples. The properties of samples buried even a few nanometers below the surface can only be probed using advanced nanotomography variants (30,31).…”
mentioning
confidence: 99%
“…On the other hand, in scanning microwave microscopy an electromagnetic wave (in the microwave range) is transmitted by the AFM cantilever and the reflected signal is also collected by the cantilever and analyzed through a vector network analyzer to deduce the power ratio of the incident and reflected waves . This technique has been shown to resolve not only the lateral location of a buried (14 nm deep) thin layer (0.2 nm thick) of phosphorus in Si, but also its vertical depth . In ultrasonic force microscopy (UFM), ultrasonic vibration of the sample stage at a frequency much higher than the AFM cantilever resonant frequency periodically modulates the indentation depth of the contact‐mode AFM tip into the sample.…”
Section: Characterizing Surfaces and Interfacesmentioning
confidence: 99%
“…As a result, only a handful of groups in the world have successfully made devices with this technique [3,9,14,15], and despite efforts directed at simplifying some parts of the process [16,17] its current application potential remains somewhat limited.…”
Section: Introductionmentioning
confidence: 99%