Nondestructive readout in plated wires

Luborsky, F. E.; Barber, William J.

doi:10.1109/tmag.1971.1067069

Cited by 6 publications

(4 citation statements)

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“…The optimum current was ,~0.1 mA for a flow of 0.3 liter/min and 1.0 mA for a flow of 1.9 liters/rain. It was also shown (2,3) that on fine-grained Cu substrates the presence of Au islands, prepared over the entire range of deposition currents, had little or no effect on the magnetic properties of the Permalloy. All of these results, obtained from the magnetic properties, are consistent with the results found in this work.…”

Section: Discussionmentioning

confidence: 99%

“…The magnetic properties developed in zero magnetostrictive Permalloy films electrodeposited on these substrates are discussed in detail elsewhere (2,3). The optimum nondestructive read-out characteristics were obtained by deposition of the Permalloy onto a substrate of coarse-grained Cu with Au islands.…”

Section: Discussionmentioning

confidence: 99%

“…Wire samples were all prepared in a continuous plating system briefly described previously (2,3). The substrate wire was either 2.2 rail diameter electropolished tungsten wire I plated with about 1~ of Au or 2.2 rail CuBe wire ~ drawn to a smooth surface finish.…”

Section: Sample Preparationmentioning

confidence: 99%

“…This area of work has been recently reviewed (1). More recently it has been shown (2,3) that the presence of gold islands on the copper, particularly on rough coarse-grained Cu, results in greatly improved magnetic properties.…”

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Characterization of a Gold-Copper Composite Surface for Plated Wire Memory

Luborsky¹,

Bréiter²,

Drummond³

1972

J. Electrochem. Soc.

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Gold electrodeposited at very low currents onto a coarse‐grained copper surface was found to enhance nondestructive read‐out (NDRO) memory performance when used as a substrate for the electrodeposition of Permalloy films. The structure of this Au layer is studied. Corrosion potential measurements are used to show that the Au covers about 0.4 of the surface when deposited on the coarse‐grain Cu to produce optimum NDRO properties but the same quantity of Au deposited on fine‐grain Cu covers ∼0.7 of the surface. The average Au thickness, grain size, lattice parameter, and coverage all show a sharp change at the same current. This current occurs just beyond the deposition current used to produce the optimum surface for NDRO memory wire. It appears to correspond to the transition from a Au island structure to a continuous film structure and is close to the point at which the Au deposition efficiency rises sharply. Scanning electron micrographs indicate the presence of Au islands at the low currents but do not have sufficient resolution to show their detailed structure.

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Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

Section: Sample Preparationmentioning

confidence: 99%

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