Nonisothermal cure kinetics of epoxy/MnxFe3-xO4 nanocomposites

Jouyandeh, Maryam; Paran, Seyed Mohammad Reza; Khadem, Seyed Soroush Mousavi; Ganjali, Mohammad Reza; Akbari, Vahideh; Vahabi, Henri; Saeb, Mohammad Reza

doi:10.1016/j.porgcoat.2019.105505

Cited by 38 publications

(35 citation statements)

References 19 publications

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“…To provide more accurate results, Kissinger–Akahira–Sunose (KAS) model was applied to calculate the activation energy in terms of the degree of cure, as expressed in Equation (6) 38 :

d ([], \ln ((), β_{i} / T_{α, i}^{1.92})) / d ([], (1 / T_{α})) = - 1.0008 ((), E_{α} / R) .

…”

Section: Resultsmentioning

confidence: 99%

Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

Khalafi

Ehsani

Khonakdar

2020

Polymers for Advanced Techs

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2,2′‐Dithiobisethanamine (cystamine), an aliphatic diamine containing exchangeable disulfide bonds, was used as the curing agent for epoxy resin. The dynamic curing kinetics and thermal stability of the epoxy/cystamine system were investigated by DSC and TGA analysis. Applied the Málek method, the Sestak–Berggren autocatalytic equation was selected to describe the cure kinetics of the epoxy/cystamine system. The results showed that the Šesták– Berggren equation is in good agreement with the experimental data. The activation energy of the curing reaction was 56.2 and 53.6 kJ mol −1, respectively, calculated by Kissinger and KAS models. Also, the glass transition temperature for the epoxy/cystamine system was slightly than that of the commonly used epoxy‐diamine systems. Moreover, the thermal degradation of the cured epoxy/cystamine network was observed at temperatures above 283°C. Further, the results obtained from the epoxy/cystamine system were compared with those obtained from the epoxy/diethylenetriamine system. All the above results suggest that cystamine has the potential to be used as the curing agent for epoxy systems.

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“…To provide more accurate results, Kissinger–Akahira–Sunose (KAS) model was applied to calculate the activation energy in terms of the degree of cure, as expressed in Equation (6) 38 :

d ([], \ln ((), β_{i} / T_{α, i}^{1.92})) / d ([], (1 / T_{α})) = - 1.0008 ((), E_{α} / R) .

…”

Section: Resultsmentioning

confidence: 99%

Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

Khalafi

Ehsani

Khonakdar

2020

Polymers for Advanced Techs

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“…In Equation (3), the ΔH ∞ and ΔH T parameters are the total enthalpy of the complete cure reaction and the heat release up to a specific temperature T, respectively. The variation of α by the curing temperature was calculated for the neat resin [ 51 , 52 ] as well as for the epoxy nanocomposites as a function of heating rate ( Figure 9 ). The S-shape α–T curves unconditionally obtained for all studied systems are a signature of the autocatalytic nature of curing reaction.…”

Section: Resultsmentioning

confidence: 99%

Bulk-Surface Modification of Nanoparticles for Developing Highly-Crosslinked Polymer Nanocomposites

et al. 2020

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Surface modification of nanoparticles with functional molecules has become a routine method to compensate for diffusion-controlled crosslinking of thermoset polymer composites at late stages of crosslinking, while bulk modification has not carefully been discussed. In this work, a highly-crosslinked model polymer nanocomposite based on epoxy and surface-bulk functionalized magnetic nanoparticles (MNPs) was developed. MNPs were synthesized electrochemically, and then polyethylene glycol (PEG) surface-functionalized (PEG-MNPs) and PEG-functionalized cobalt-doped (Co-PEG-MNPs) particles were developed and used in nanocomposite preparation. Various analyses including field-emission scanning electron microscopy, Fourier-transform infrared spectrophotometry (FTIR), thermogravimetric analysis (TGA), X-ray diffraction (XRD) and vibrating sample magnetometry (VSM) were employed in characterization of surface and bulk of PEG-MNPs and Co-PEG-MNPs. Epoxy nanocomposites including the aforementioned MNPs were prepared and analyzed by nonisothermal differential scanning calorimetry (DSC) to study their curing potential in epoxy/amine system. Analyses based on Cure Index revealed that incorporation of 0.1 wt.% of Co-PEG-MNPs into epoxy led to Excellent cure at all heating rates, which uncovered the assistance of bulk modification of nanoparticles to the crosslinking of model epoxy nanocomposites. Isoconversional methods revealed higher activation energy for the completely crosslinked epoxy/Co-PEG-MNPs nanocomposite compared to the neat epoxy. The kinetic model based on isoconversional methods was verified by the experimental rate of cure reaction.

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“…However, the wider temperature window of cure for nanocomposites compared to blank epoxy to chemical aspect of cure reaction while diffusion governs conversion in higher temperature [62,63]. Although using 0.1% MOF couldn't change the maximum peak temperature (Tp) significantly compared to blank sample, enhancement of released heat (ΔH∞) regardless of heating rate shows a promotion in cure state.…”

Section: Nonisothermal Dsc Analysismentioning

confidence: 99%

Synthesis, characterization, and high potential of 3D metal–organic framework (MOF) nanoparticles for curing with epoxy

Jouyandeh

Tikhani

Shabanian

et al. 2020

Journal of Alloys and Compounds

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In this study, the potential of microporous 3D metal-organic framework (MOF) for curing epoxy resin has been discussed. First, MIL-101 (Cr), a chromium based MOF, was synthesized under hydrothermal condition and then characterized by using Fourier transform infrared (FTIR) spectroscopy, X-ray diffraction (XRD) and thermogravimetric (TGA) measurements. Epoxy nanocomposites containing 0.1, 0.3 and 0.5 wt.% of MOF nanocrystals were subsequently prepared and their curability was studied in terms of the universal dimensionless Cure Index (CI) criterion under nonisothermal differential scanning calorimetry (DSC). Based on calculations made on the basis of the CI, epoxy nanocomposites containing 0.1, 0.3, and 0.5 wt.% of MOF were labeled Good and Excellent thanks to an enhanced chemical interaction between MOF and epoxy matrix, where the heat of cure in the system was surprisingly even higher than that of the neat epoxy. It was demonstrated that introduction of MOF into epoxy significantly improved the heat release during crosslinking process of epoxy, as indicated by a 63% rise in the enthalpy of cure at MOF loading of 0.1 wt.%. Addition of thermally stable MOF nanomaterials to the epoxy resin improved thermal decomposition resistance of epoxy. Up to 0.3 wt.% loading, the system revealed acceptable thermal stability at elevated temperature featured by more residue remained at the end of test, while sample containing 0.5 wt.% MOF resisted against decomposition at early stages of degradation due to higher thermal stability of MOF with respect to epoxy resin.

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Nonisothermal cure kinetics of epoxy/MnxFe3-xO4 nanocomposites

Cited by 38 publications

References 19 publications

Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

Bulk-Surface Modification of Nanoparticles for Developing Highly-Crosslinked Polymer Nanocomposites

Synthesis, characterization, and high potential of 3D metal–organic framework (MOF) nanoparticles for curing with epoxy

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