2009
DOI: 10.1016/j.ijheatmasstransfer.2008.11.002
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Nonlinear optimal on-line heat-dissipation control methodology in electronic devices

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Cited by 28 publications
(4 citation statements)
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“…The SNOM transmission and reflection-mode maps over the same region are presented in Figure 3b,c respectively, while panel d shows the temperature profile of the sample. A local optical absorption profile can be determined using the near-field transmission and reflectance signals to determine the local temperature profile and be used to calculate the local thermal expansion maps from š›¼ f (x 0 ,y 0 ) in Equation (5). TEC maps of ML-G platelets are presented in Figure 3e-i for frequencies šœ” = 100, 200, 400, and 700 Hz, respectively.…”
Section: Sparse Multilayer Graphene (Ml-g) Platelets On Glassmentioning
confidence: 99%
See 1 more Smart Citation
“…The SNOM transmission and reflection-mode maps over the same region are presented in Figure 3b,c respectively, while panel d shows the temperature profile of the sample. A local optical absorption profile can be determined using the near-field transmission and reflectance signals to determine the local temperature profile and be used to calculate the local thermal expansion maps from š›¼ f (x 0 ,y 0 ) in Equation (5). TEC maps of ML-G platelets are presented in Figure 3e-i for frequencies šœ” = 100, 200, 400, and 700 Hz, respectively.…”
Section: Sparse Multilayer Graphene (Ml-g) Platelets On Glassmentioning
confidence: 99%
“…With critical advances in integrated power electronics, [1] there has been a tremendous demand for nanoscale thermal management in the pursuit of miniaturization and integration of submicrometric components preserving high power density, for DOI: 10.1002/admi.202300806 example for applications in telecommunications, aircraft engines, and renewable and sustainable energy storage. [2][3][4] The need for heat dissipation is essential in many of such applications [5] as it assists in preserving the efficiency and lifespan of the circuitry components. Heat spreaders and heat sinks are typically integrated for the purpose of discharging local thermal buildup from long device operation times.…”
Section: Introductionmentioning
confidence: 99%
“…P M = (I DSrms ) 2 R DSon (18) In addition to improving the energy conversion efficiency of the converter through the improvement of the material itself, the thermal loss brought about by the current also occupies an important part of the energy loss, therefore, some researchers stand on the electro-thermal point of view to study the energy consumption of the converter. Part of the energy stored in the power electronics converter to inhibit hardware temperature rise, to meet both the application for the demand for power and focus on the control of electric heat, Wayne Weaver et al proposed a kind of multi-objective planning problem with constraints, in order to satisfy the objective function to achieve the minimum power loss at the same time, the converter will be kept stable for the operation of the temperature requirements and other relevant factors will be used as boundary conditions or constraints, which will be more effective in evaluating the energy consumption of power electronics converter [32][33][34][35].…”
Section: Switching and Conduction Lossesmentioning
confidence: 99%
“…In many transient convective heat transfer problems, the unknown time-varying thermal boundary conditions (BCs) are difficult to be measured directly [1], yet whose online estimation is essential for improving the stability and performance of the thermal system in various engineering applications, such as aerospace thermal protection [2], chip cooling [3],…”
Section: Introductionmentioning
confidence: 99%