Nonstatistical fluctuations in fragmentation of target nuclei in high energy nuclear interactions

Ghosh, Dipak; Ghosh, P.; Ghosh, A.; Roy, J.

doi:10.1088/0954-3899/20/7/008

Cited by 38 publications

(41 citation statements)

References 7 publications

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“…Often, Ni and Ni-based alloys, which are also solderable metals, are considered to be excellent alternatives for Cu substrates. The rate of dissolution of Ni in Sn-based solders is very low at the soldering temperature so that only a very thin IMC layer is generally observed between Ni and the Sn-based solders [9][10][11]. This is the reason that Ni/Au and Ni/Pd metallization schemes are widely applied as substrates for solder joints in advanced microelectronics packaging.…”

Section: Introductionmentioning

confidence: 99%

“…Because of the prime importance of the interfacial reaction between solder alloys and metal substrates, the morphologies and the growth kinetics of the IMC layer in the Sn/Ni system have been widely researched and reported [9,10,[12][13][14][15][16][17][18][19][20][21][22][23][24][25][26]. However, it is difficult to achieve a clear image regarding the phases, their morphologies and growth kinetics (in particular, the time exponent) of the IMC layer in the Sn/Ni interfacial reaction system from the literature because there are ambiguous results reported and some results are in conflict.…”

Section: Introductionmentioning

confidence: 99%

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Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

2009

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

2009

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“…2,3 Observations of the intermetallic growth in the solid-Cu͑Ni͒/liquid-Sn system ͑above the melting point of the solder͒ instead of a smooth layer always show rough compound layers, which is manifested in the appearance of scallops of the intermetallic phase. [4][5][6][7][8][9] With time scallops grow larger but fewer, indicating that the coarsening process takes place. [6][7][8] The mechanism of coarsening is not fully understood yet.…”

Section: Introductionmentioning

confidence: 99%

“…[4][5][6][7][8][9] With time scallops grow larger but fewer, indicating that the coarsening process takes place. [6][7][8] The mechanism of coarsening is not fully understood yet. To describe this process Kim et al 6 and Kim and Tu 10 suggested a two-flux nonconservative Ostwald ripening model, which is based on the assumption that "the rapid growth of the Cu 6 Sn 5 compounds on the solder side can be explained by the dissolution of Cu into the liquid solder, precipitation, and the coarsening of the scallop-type Cu 6 Sn 5 compound by Ostwald ripening" ͑p.…”

Section: Introductionmentioning

confidence: 99%

Early stages of soldering reactions

Lord

Umantsev

2005

Journal of Applied Physics

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An experiment on the early stages of intermetallic compound layer growth during soldering and its theoretical analysis were conducted with the intent to study the controlling factors of the process. An experimental technique based on fast dipping and pulling of a copper coupon in liquid solder followed by optical microscopy allowed the authors to study the temporal behavior of the sample on a single micrograph. The technique should be of value for different areas of metallurgy because many experiments on crystallization may be described as the growth of a layer of intermediate phase.Comparison of the experimental results with the theoretical calculations allowed one to identify the kinetics of dissolution as the rate-controlling mechanism on the early stages and measure the kinetic coefficient of dissolution. A popular model of intermetallic compound layer structure coarsening is discussed.

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“…In this analysis we have focussed our attention to the events generating from the collisions with the AgBr nuclei only and have discarded all other types of events. So, according to the selection procedure mentioned above we have chosen 730 events of16 OAgBr interactions at 2.1 AGeV[13], 800 events of 24 Mg-AgBr interactions at 4.5 AGeV[18], 800 events of 12 C-AgBr interactions at 4.5 AGeV[19], 250 events of16 O-AgBr interactions at 60 AGeV…”

mentioning

confidence: 99%

Rapidity dependence of multiplicity fluctuations and correlations in high-energy nucleus–nucleus interactions

et al. 2011

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The multiplicity fluctuations of the produced pions were studied using scaled variance method in 16 O-AgBr interactions at 2.1 AGeV, 24 Mg-AgBr interactions at 4.5 AGeV, 12 CAgBr interactions at 4.5 AGeV, 16 O-AgBr interactions at 60 AGeV and 32 S-AgBr interactions at 200 AGeV at two different binning conditions. In the first binning condition, the rapidity interval was varied in steps of one centring about the central rapidity until it reached 14. In the second case, the rapidity interval was increased in steps of 1.6 up to 14.4. Multiplicity distributions and their scaled variances were presented as a function of the dependence on the rapidity width for both the binning conditions. Multiplicity fluctuations were found to increase with the increase of rapidity interval and later found to saturate at larger rapidity window for all the interactions and in both the binning conditions. Multiplicity fluctuations were found to increase with the energy of the projectile beam. The values of the scaled variances were found to be greater than one in all the cases in both the binning conditions indicating the presence of correlation during the multiparticle production process in high-energy nucleus-nucleus interactions. Experimental results were compared with the results obtained from the Monte Carlo simulated events for all the interactions. The Monte Carlo simulated data showed very small values of scaled variance suggesting very small fluctuations for the simulated events. Experimental results obtained from 16 O-AgBr interactions at 60 AGeV and 32 SAgBr interactions at 200 AGeV were compared with the events generated by Lund Monte Carlo code (FRITIOF model). FRITIOF model failed to explain the multiplicity fluctuations of pions emitted from 16 O-AgBr interactions at 60 AGeV for both the binning conditions. However, the experimental data agreed well with the FRITIOF model for 32 S-AgBr interactions at 200 AGeV.

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Nonstatistical fluctuations in fragmentation of target nuclei in high energy nuclear interactions

Cited by 38 publications

References 7 publications

Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

Early stages of soldering reactions

Rapidity dependence of multiplicity fluctuations and correlations in high-energy nucleus–nucleus interactions

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