Notch effect on creep–fatigue life for Sn–3.5Ag solder

Nozaki, Mineo; Zhang, Shengde; Sakane, Masao; Kobayashi, Kaoru

doi:10.1016/j.engfracmech.2011.02.001

Cited by 12 publications

(6 citation statements)

References 12 publications

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“…References [81,82] have demonstrated that the notch weakening effect is clearly observed for the cases mentioned. Moreover, in general, the notch weakening effect is more remarkable for a large stress concentration factor than that for a small stress concentration factor (see Fig.…”

Section: Strain-controlled Modementioning

confidence: 88%

See 1 more Smart Citation

Notch Effect on Structural Strength of Components at Elevated Temperature Under Creep, Fatigue, and Creep-Fatigue Loading Conditions: Phenomenon and Mechanism

Gong

Cheng

Xuan

et al. 2019

Journal of Pressure Vessel Technology

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Structural discontinuities (e.g., nozzle, hole, and groove) widely occur in many high temperature components of nuclear and fossil power plants. In general, the notched component is used for simplified tests and analyses due to the complexity of the introduction of a practical component. In the previous work, the effects of the notch on failure life of the components have been reported experimentally, including the strengthening and weakening effects; however, the internal mechanisms have not been clearly demonstrated. This work reviews the notch effects on the structural strength of the notched components at elevated temperatures under creep, fatigue, and creep-fatigue loading conditions. Experimental phenomena (i.e., strengthening or weakening effects) for typical notched specimens subjected to the above three loading conditions are summarized, and the related factors for notch effects on creep rupture life or cycle to failure of the components are discussed. The mechanisms for the strengthening or weakening effects induced by a notch are described. Evaluation procedures for notch effect analysis under complex loading conditions are also included, and the primary challenges concerning the notch effect are provided for further investigations.

show abstract

Section: Strain-controlled Modementioning

confidence: 88%

“…For notched bar specimens, strain-controlled creep-fatigue experimental studies on the notched bar components are reported [71,[81][82][83][84][85][86]. For stress-controlled mode mentioned above, the uniform stress at the notch plane is kept as the same as that of the smooth specimens.…”

Section: Strain-controlled Modementioning

confidence: 99%

Notch Effect on Structural Strength of Components at Elevated Temperature Under Creep, Fatigue, and Creep-Fatigue Loading Conditions: Phenomenon and Mechanism

Gong

Cheng

Xuan

et al. 2019

Journal of Pressure Vessel Technology

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“…It is required for an electronic device designing to investigate not only mechanical properties and fatigue life but also crack propagation behavior of the candidate lead-free solders. Some researches argue that almost all the fatigue life of solders occurs at crack propagation stage, so that evaluation of the crack propagation behavior at commercial usage temperature is useful for fatigue life estimation [1][2][3][4][5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle Fatigue

Hiyoshi

2017

Acta Metall. Sin. (Engl. Lett.)

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In this study, a crack initiation and propagation behavior of Sn-5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push-pull loading tests with a single-hole specimen have been conducted at 313 K to investigate the crack initiation and propagation behavior of Sn-5Sb solder which has a higher melting point temperature than that of SnAg -Cu solders. A fatigue life ratio correlates with the crack length within a small scatter. Crack initiates at the early stage, and almost all the life period is crack propagation process independent of strain range and strain rate. The crack propagation rate depends on the strain range and the strain rate. The adaptation of J-integral value for Sn-5Sb solder is also discussed. J-integral value is a suitable parameter for crack propagation rate evaluation.

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“…There are some research papers on cyclic fatigue test (Yoshioka, et al, 1990, The Society of Materials Science, Japan, 2001, Taneda, et al, 1992a, Taneda, et al, 1992b, Yamamoto, et al, 1995, Yamamoto, et al, 1997, Chen, et al, 2006, Nozaki, et al, 2008, Zhu, et al, 2014, creep rupture test (Takada, et al, 2000a, Takada, et al, 2000b, The Society of Materials Science, Japan, 2004, Mahmudi, et al, 2007 and creep-fatigue test (Yamamoto, et al, 1997, Shiratuchi, et al, 1999, Yamada, et al, 2000, Nozaki, et al, 2001, Nozaki, et al, 2011, Fakpan, et al, 2011, Yamamoto, et al, 2012 of solders, but almost of them were conducted at room temperature or above it. The reason for there is little research paper on fatigue test of solders at low temperature is technical difficulty in testing at below the freezing point.…”

Section: Introductionmentioning

confidence: 99%

Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures

Hiyoshi

2016

Mechanical Engineering Journal

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This paper describes creep-fatigue lives of Sn-3.5Ag lead-free solder at low temperatures. Since solders have lower melting temperature and electronic devices are often used at low temperature environment, it is effective for improving the fatigue life evaluating precision of solder joints to make clear the mechanical properties and creep-fatigue properties of solders at low temperatures. Cyclic push-pull fatigue tests with various strain waveforms were conducted at 253K and 273K to examine influence of strain rate and testing temperature on fatigue life of Sn-3.5Ag lead-free solder. Creep-fatigue lives under unsymmetrical full reversed strain waveform were smaller than that of symmetrical waveform at low temperatures. An application of five kinds of creepfatigue life evaluation parameters for electronic materials at low temperatures was also discussed. They are Linear Damage Rule, Frequency Modified Fatigue Life, Ductility Exhaustion Model, Strain Range Partitioning method and Grain Boundary Sliding Model. Grain Boundary Sliding Model, which has been proposed as a fatigue life evaluation parameter for Pb-content solders and lead-free solders at high temperatures, was a suitable parameter for the correlation of creep-fatigue lives of Sn-3.5Ag lead-free solder at low temperatures. Grain Boundary Sliding Model parameter predicted almost all of the experimental lifetimes within a small scatter conservatively.

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Notch effect on creep–fatigue life for Sn–3.5Ag solder

Cited by 12 publications

References 12 publications

Notch Effect on Structural Strength of Components at Elevated Temperature Under Creep, Fatigue, and Creep-Fatigue Loading Conditions: Phenomenon and Mechanism

Notch Effect on Structural Strength of Components at Elevated Temperature Under Creep, Fatigue, and Creep-Fatigue Loading Conditions: Phenomenon and Mechanism

Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle Fatigue

Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures

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