Novel 2,5-bis(6-(trimethylamonium)hexyl)-3,6-diaryl-1,4-diketopyrrolo[3,4-c]pyrrole pigments as levelers for efficient electroplating applications

Li, Jun; Xu, Jingjun; Wang, Xiaomin; Wei, Xiaochuan; Lv, Jinge; Wang, Limin

doi:10.1016/j.dyepig.2020.109064

Cited by 22 publications

(7 citation statements)

References 44 publications

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“…7(a and c) , indicating that sulfur atoms are the main electrophilic attack region. According to the previous report, 21 when the benzene ring is attached to an electron-donating group, the HOMO and LUMO energy levels increase simultaneously, but the HOMO energy level increases more. The electron donating ability of the hydroxyl group on benzene ring is stronger than that of the hydrogen atom on benzene ring, so that the E HOMO and E LUMO values of HPTT are higher than those of PMT.…”

Section: Resultsmentioning

confidence: 86%

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1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia

et al. 2022

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Section: Resultsmentioning

confidence: 86%

“…The filling rate ( F ) of microvias is defined by eqn (2):where A is the distance from the top of microvias to the bottom, B is the distance from the bottom of microvias to the surface of PCBs, 21,22 as illustrated in Fig. 2, and C is the electroplating copper thickness on the surface of PCBs.…”

Section: Methodsmentioning

confidence: 99%

1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia

et al. 2022

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“…In order to further explore the large blind hole filling ability of the quaternary ammonium, GMs experiment [30][31][32][33] under two different rotation speeds are carried out to analyze the effect of the synergistic effect of these suppressor s and accelerators on the copper deposition behavior at the bottom and surface of the blind holes and the corresponding results are shown in figure 8, where the GMs curve of traditional additives also provides for comparison. Here, the high rotation speed simulates the high current region of the surface of blind hole of PCB, while the low rotation speed referred to the low current region of the bottom of the blind holes.…”

Section: Interaction Mechanisms Of Three Additives In the Cu Electrop...mentioning

confidence: 99%

“…Here, the high rotation speed simulates the high current region of the surface of blind hole of PCB, while the low rotation speed referred to the low current region of the bottom of the blind holes. In the GM experiment, the polarization potential difference (∆η) defined by ∆η = η 100 rpm − η 1500 rpm different rotation speeds is used to evaluate the curvature-dependent adsorption behavior of the additive and then reflect the filling capacity of the additive [27,31,33]. A larger potential difference usually means the greater tendency for the selective adsorption of additives in the high current region and low current region, which implies a greater inhibitory effect for the copper deposition on the surface of the blind holes.…”

Section: Interaction Mechanisms Of Three Additives In the Cu Electrop...mentioning

confidence: 99%

The effect of quaternary ammonium salts with different chain lengths on copper filling behavior in blind holes of printed circuit board

Shen¹,

Zhou²,

Huang³

et al. 2022

J. Micromech. Microeng.

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The rapid and defect free blind hole copper super filling is the key technology to ensure the quality and development of printed circuit boards (PCBs). The linear quaternary ammonium compounds with a low molecular weight are expected to act as a potential suppressor for blind hole copper filling. Here, three quaternary ammonium salts with different molecular chain lengths (the dodecyl trimethyl ammonium chloride, the cetyl trimethyl ammonium chloride and the stearyl trimethyl ammonium chloride) were selected to study the effects of the molecular chain length of quaternary ammonium salt on the copper filling behavior of the PCB blind holes. The electrochemical results show that the three quaternary ammonium salts show greater inhibition ability on copper deposition compared with the traditional additives (polyethylene glycol (PEG) and Cl−) and furthermore, the suppressor effect becomes stronger with the increase of molecular weight. The blind hole copper filling experiment of PCB is also carried out to study the copper filling capacity of three quaternary ammonium salts. The filling experiment reveals that compared with the traditional suppressors (PEG and Cl−), the filling quality of blind hole copper is significantly improved when the three quaternary ammonium salts are used as suppressors. Moreover, under the coordination of accelerator (bis (3-sulfopropyl) disulfide (SPS)), the three quaternary ammonium salts can realize more rapid copper super filling without chloride ion in the electrolyte. Cross-section and surface morphological analysis further illuminates that the quaternary ammonium salt as an suppressor can also more effectively inhibit the deposition of copper on the PCB surface and reduce the roughness of the copper layer. The present results imply that quaternary ammonium salts have greater advantages for copper filling and are expected to replace traditional suppressors as new suppressors.

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“…Levelers are used to obtain smooth coatings since they locally decrease the copper electrodeposition rate on the surface protrusions and promote its growth in hollows, as a result of which the surface roughness of the copper deposit decreases. Nitrogen-containing heterocyclic and high-molecular compounds are among the most common levelers [28][29][30][31][32].…”

Section: Introductionmentioning

confidence: 99%

Electrocrystallization and Morphology of Copper Coatings in the Presence of Organic Additives

Kozaderov,

Sotskaya,

Yudenkova

et al. 2023

Coatings

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Copper coatings with refined grains and smooth surface morphology were electrodeposited from electrolytes comprising a novel accelerator, the disodium salt of 4,4-dithiobenzene disulfonic acid (DBDA), with sodium chloride and polyethylene glycol (PEG) as inhibitors and 2-aminobenzothiazole (ABT) as a leveler. It was found that the morphology of the coatings strongly depends on the presence and type of additives. In the presence of only DBDA and NaCl, large crystallites are formed, whereas the addition of PEG and ABT significantly decreases their size, and the most fine-grained, smooth, and defect-free copper coating is formed with the combined use of all additives. To establish the correlation between the observed morphology and the kinetics of the additive-assisted copper electrocrystallization in the proposed electrolytes, the nucleation mechanism and its parameters were determined by transient electrochemical characterization. The extended nucleation model, which takes into account not only the copper deposition but also the electric double-layer charging and hydrogen reduction process, was used to establish the electrocrystallization kinetics in the presence of the additives. The results of such kinetic analyses can help to explain the morphological effect. By using the chronopotentiometry method, it was found that the addition of the disodium salt of 4,4-dithiobenzene disulfonic acid with chloride ions gives a catalytic effect, while the sequential introduction of polyethylene glycol and 2-aminobenzothiazole provides an increasing inhibitory effect. Voltamperometry and chronoamperometry tests showed that the process is controlled by the diffusion of ions to the growing three-dimensional cluster of a new phase. The introduction of additives into the electrolyte slows down the copper electroplating process at comparatively negative potentials and increases the probability of transition from instantaneous to progressive nucleation. Moreover, the rate of the process and the density of nucleation active sites increase (up to 2–3 times) with the addition of DBDA but decrease significantly (up to 5–8 times) in the presence of PEG and ABT, which additionally confirms their catalytic and inhibitory effects, respectively, and explains the significant smoothing effect on the morphology of the Cu-coatings.

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Novel 2,5-bis(6-(trimethylamonium)hexyl)-3,6-diaryl-1,4-diketopyrrolo[3,4-c]pyrrole pigments as levelers for efficient electroplating applications

Cited by 22 publications

References 44 publications

1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia

1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia

The effect of quaternary ammonium salts with different chain lengths on copper filling behavior in blind holes of printed circuit board

Electrocrystallization and Morphology of Copper Coatings in the Presence of Organic Additives

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