2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC &Amp 2018
DOI: 10.1109/pvsc.2018.8548276
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Novel Approach for the Bonding of III-V on Silicon Tandem Solar Cells with a Transparent Conductive Adhesive

Abstract: The currently used options for the monolithic interconnection of sub-cells in a Si and III-V tandem solar cell device are direct wafer-bonding or hetero-epitaxy. Both methods are costly and difficult to transfer into an industrial process. This work presents a novel, scalable and cost-efficient process for the interconnection of semiconductor substrates by using a transparent conductive oxide (TCO) interlayer. The TCO material is sprayed from a solution onto both sub-cells which are subsequently connected by u… Show more

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Cited by 5 publications
(7 citation statements)
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References 11 publications
(11 reference statements)
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“…Losses due to parasitic absorption in the ZnO-based TCA layer are below 2% within the relevant wavelength range, as it has been already demonstrated [7]. Also, very promising results for a TiO 2 -based ARC at the TCA-semiconductor interface have already been published [1].…”
Section: Optical Simulation Of Bond Layermentioning
confidence: 59%
“…Losses due to parasitic absorption in the ZnO-based TCA layer are below 2% within the relevant wavelength range, as it has been already demonstrated [7]. Also, very promising results for a TiO 2 -based ARC at the TCA-semiconductor interface have already been published [1].…”
Section: Optical Simulation Of Bond Layermentioning
confidence: 59%
“…A simplified sketch of the glued cell structure is shown in Figure 2. However, the developed bonding process flow as described in [4] did not result in mechanically stable bonds. Only by implementing an initial pressing at a low temperature (125°C, 0.33 N/cm²), a mechanically stable interconnection of a III-V/Si tandem solar cell (both semiconductor surfaces at the bond planar) was realized.…”
Section: Bonding Of the First Tandem Solar Cellmentioning
confidence: 98%
“…Implementing a particle-based TCA (Ag coated particles) has already shown a very promising efficiency of 26.4% (in two-terminal configuration) [3]. In this publication we will show the progress of a newly developed particle-free TCA, which does not need the addition of conductive particles but becomes conductive itself upon thermal annealing at 300°C [4]. The adhesive is a dissolved zinc precursor which upon heating decomposes to ZnO.…”
Section: Introductionmentioning
confidence: 98%
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“…The concept of HBTSC is material-agnostic, but in this paper, we will focus on the case where the HBTSC is made of III-V semiconductors. For the III-V-HBTSC-on-Si device to be cost-effective, the III-V HBTSC has to be fabricated with lowcost techniques, transferred to the top of the silicon cell and glued with a low-cost transparent conductive adhesive [4], [5]. If other materials are chosen, potentially cheaper fabrication techniques could be employed, possibly at the cost of efficiency.…”
mentioning
confidence: 99%