1992
DOI: 10.1002/pen.760322115
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Novel auto‐photosensitive polyimides with tailored properties

Abstract: An overview is given on auto‐photosensitive polyimides as introduced for the first time in 1985. It is shown how development proceeded and how the chemical basis of auto‐photosensitive polyimides was extended beyond BTDA. Novel “photosensitizer tetracarboxylic dianhydrides” like 2,3,6,7‐thioxanthonetetracarboxylic dianhydride (TXDA) were synthesized and copolymerized into preimidized nonphotoactive polyimides containing tetracarboxylic acids like 6FDA or ODPA. Novel photosensitive polyimides were obtained that… Show more

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Cited by 27 publications
(12 citation statements)
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“…The relationships between photosensitivity and chemical structure of ortho-alkyl substituted polyimides was investigated in a more quantitative way by Rohde et al 50 with a series of homopolymers and copolymers having a weight average molecular weight eM w) in the range 30 000 to 45 000. Their experimental results led to the conclusion that photosensitivity is proportional to if wand approximately proportional to the square of inherent viscosity (l1inW.…”
Section: Negative Tone Polymersmentioning
confidence: 99%
“…The relationships between photosensitivity and chemical structure of ortho-alkyl substituted polyimides was investigated in a more quantitative way by Rohde et al 50 with a series of homopolymers and copolymers having a weight average molecular weight eM w) in the range 30 000 to 45 000. Their experimental results led to the conclusion that photosensitivity is proportional to if wand approximately proportional to the square of inherent viscosity (l1inW.…”
Section: Negative Tone Polymersmentioning
confidence: 99%
“…The adhesion between the photoresist and the substrate is fairly poor and requires rigorous conditions for the temperature, humidity, and the substrate surface. [5][6][7][8][9] In order to modify these disadvantages, we introduced some siloxane structure into the main chain of the auto-photosensitive PSPI.…”
Section: Introductionmentioning
confidence: 99%
“…Photosensitive polyimides (PSPIs), because of their excellent combined physical and chemical features and easy processing characteristics, have been extensively employed in advanced microelectronics packaging as interlayer dielectrics in multilayer structures and dielectric multichip modules, passivation layers and α‐particle barriers on chips, stress relief buffer coatings in high‐density electronic packaging, and so forth 1–9. PSPIs, in the negative photoimaged mode, are usually formulated from poly(amic acid)s (PAAs), which contain photosensitive crosslinking sites in polymer backbones introduced either by chemical bonding or by saltlike linking 10–12. Their major drawbacks for advanced microelectronics applications include the heavy dimensional shrinkage and deteriorated mechanical properties of the thermally cured polyimide photopatterns caused by the significant evolution of organic volatiles derived from the photosensitive additives and solvents.…”
Section: Introductionmentioning
confidence: 99%