Novel bismaleimide/diallylbisphenol A resin modified with multifunctional thiol containing isocyanuric ring and long-chain aliphatic unit

Abstract

4,4 0 -Diphenylmethane bismaleimide (BMI)/2,2 0 -diallylbisphenol A (DABPA) resin was modified with a multifunctional thiol containing isocyanuric ring and long-chain aliphatic unit (tris[(3-mercaptopropionyloxy)-ethyl]-isocyanurate (TEMPIC)). To investigate the relationship of the curing reaction and properties of cured BMI/DABPA resin modified with TEMPIC, the temporal change in the functional groups during the curing reaction process was analyzed using Fourier transform infrared analysis. Despite the decreased cross-link density with increasing TEMPIC concentration, the glass transition temperature of BMI/DABPA resin was not decreased by modification with TEMPIC. The storage modulus of BMI/DABPA/ TEMPIC resin maintained a value on the order of 10 9 Pa in the rubber region, which is similar to that of the unmodified resin. The fracture toughness and flexural strength were also improved by modification with TEMPIC. Moreover, the observation of the fracture surface of BMI/DABPA/TEMPIC resin using scanning electron microscopy showed a uniform structure with no phase separation. These results were consistent with the single -relaxation peak in the loss tangent curve of the dynamic viscoelastic behavior.

UV and Thermal Cure Epoxy Adhesives

“…FT-IR was performed to measure and analyze quantitatively cure behaviour of the adhesive sample [46][47][48]. The spectrum of adhesive samples cured at UV cure and UV + thermal cure conditions as well as non-cure samples was measured by the use of Varian 610-IR Fourier Scheme 6.…”

Characterization and properties of high-temperature resistant structure adhesive based on novel toughened bismaleimide resins

“…Many efforts have been devoted to the toughening modification of BMI resins by reducing their crosslinking density, incorporating the micro-phase separation structure or forming the interpenetrating polymer network. The main modification methods contain the design and synthesis of novel chain-extended BMI monomers, 6,7 copolymerization with allyl compounds, 8,9 Michael addition with aromatic diamines, [10][11][12] co-curing with other thermosetting resins and physical blends with thermoplastic resins, [13][14][15] rubber elastomers [16][17][18] and so on. Allyl compounds are often liquid, their usage as a building block can prepare modified BMI resins with good processability, and the resultant BMI cured products have outstandingly improved toughness.…”

Asymmetric bismaleimide-based high-performance resins with improved processability and high Tg over 400 °C

“…To improve the processing performance of DDM-BMI, lots of work have been done, one of the conventional strategies is to blend bismaleimides with other high-performance resins such as cyanate ester, 12,13 epoxy resin, 14,15 benzoxazine, 16,17 diamine, 18,19 and 2,2′-diallylbisphenol A. 20,21 These resins could react with bismaleimides, giving rise to prepolymers with low molecular weight which display superior solubility in organic solvents or low molten viscosity. 22,23 However, the mixture of these resins with flexible chains is unstable while being heated, and it may deteriorate the thermal properties of cured bismaleimides.…”