Novel Ceramic‐Based Material for the Applications of Molded Interconnect Devices (3D‐MID) Based on Laser Direct Structuring

Abstract

Molded interconnect devices (MID) based on laser direct structuring LPKF‐LDS® technology are widely used in the realm of electronics. Nowaday, design and development of new materials with improved properties for 3D‐MID are in focus. In this work, novel materials based on alumina ceramic with copper oxide additives are developed for this technology. The effect of the sintering temperature and the doping amount of copper oxide on the metallization quality is investigated. Furthermore, the influence of laser process parameters (e.g., laser power, velocity’, and frequency) on process output namely groove dimensions, groove profile, characteristics of structured area, and quality of the final 3D‐MID products are discussed. The novel ceramic materials show high flexibility to realize very fine structures. Moreover, the laser‐structured and metallized area shows a free edge lap with good quality. After metallization high accuracy with copper line/pitch of 16 μm/20 μm is achieved.

3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review

“…In order to work with LDS method, usable plastics for LDS required specific additives such as Cu 2 O, CuO or CuCl 2 , which can be added in a very high concentration to the blend during compounding step. The characteristic of these additives is extreme heat resistance and great potential to prevent nucleation during injection molding process [ 28 , 29 , 30 , 31 , 32 , 33 , 34 , 35 , 36 , 37 , 38 ]. However, it is also possible to prepare plastics for LDS without specific additives.…”

“…LDS is based on the principle of ablation and nucleation by using laser irradiation. Therefore, the laser patterning creates a microscopically rough surface and simultaneously activates the specific additives that are necessary for the metallization step [ 28 , 29 , 30 , 31 , 32 , 33 , 34 , 35 , 36 , 37 , 38 ]. The schematic of LDS method is illustrated in Figure 1 .…”

Effect of HIP Treatment on Fatigue Notch Sensitivity of Ti–6Al–4V Alloy Fabricated by Electron Beam Melting

“…In this process, the particles in the affected layers are completely melted and the as-fabricated products possess strength and elongation comparable to the wrought products [1]. Compared with selective laser melting (SLM), electron beam melting (EBM) is capable of fabricating components with much lower residual stress despite rougher surfaces due to its higher beam energy, and has received great interest in the manufacture of aerospace and medical implants [2][3][4][5][6][7].…”

Air‐Pressure‐Assisted Pen‐Nib Printing for 3D Printed Electronics

“…Meanwhile, 3D-MID initially forms 3D objects by the plastic injection molding of a thermoplastic resin including metallic catalysts and then selectively metallizes 3D molded objects using a two-step process: laser direct structuring (LDS) and electroless deposition (ELD). [8,[12][13][14][15] Metallic catalysts on the surface of 3D objects have been activated by laser scanning; thus, creating conductive patterns via a subsequent ELD. 3D-MID can extend the range of classical PCBs to three dimensions and produce electronic 3D structures in which electrical circuits are routed over any 3D surface.…”