Novel CMP Material Solution To Enable High Removal Rate Dielectric CMP For Hybrid Bonding Application

Chakraborty, Tapash; Verhaverbeke, Steven; Chen, Han-Wen; Chandran, Gopi

doi:10.1109/eptc56328.2022.10013230

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022

DOI: 10.1109/eptc56328.2022.10013230

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Novel CMP Material Solution To Enable High Removal Rate Dielectric CMP For Hybrid Bonding Application

Tapash Chakraborty

Steven Verhaverbeke

Han-Wen Chen

et al.

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Novel CMP Material Solution To Enable High Removal Rate Dielectric CMP For Hybrid Bonding Application

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