2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 2018
DOI: 10.1109/eptc.2018.8654375
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Novel Concept of an In-situ Test System for the Thermal-Mechanical Fatigue Measurement for Reliability Evaluation of Electronic Solder Joints

R. Metasch
1
,
M. Roellig
2
,
Uwe Naumann3
et al.
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Cited by 4 publications
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A competition between stress triaxiality and joule heating on microstructure evolution and degradation of SnAgCu solder joints

Siswanto
1
,
Arun
2
,
Krasnopevtseva
3
et al. 2020
Journal of Manufacturing Processes
17
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A competition between stress triaxiality and joule heating on microstructure evolution and degradation of SnAgCu solder joints

Siswanto
1
,
Arun
2
,
Krasnopevtseva
3
et al. 2020
Journal of Manufacturing Processes
17
0
3
0
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Optimized TMF Measurement Setup for Reproducible Lifetime Measurements on Solder Joints Under Accelerated Thermal-Mechanical Conditions

Metasch
1
,
Roellig
2
,
Schwerz
3
et al. 2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing

Gleichauf
1
,
Maniar
2
,
Kuczynska
3
et al. 2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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