Novel engineering coatings produced by closed-field unbalanced magnetron sputtering

Kelly, Peter; Arnell, R.D.; Ahmed, Waqar; Afzal, A

doi:10.1016/s0261-3069(97)00009-5

Cited by 19 publications

(9 citation statements)

References 5 publications

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“…Over the past decades magnetron sputtering has become an extremely important technology for thin film deposition in a wide range of industrial applications. These include metalization in integrated circuits, 9,14 coatings for wear resistance and corrosion protection, 78 large area coating of architectural glass, 79 and display applications. 80 Depending on the application the applied target voltage can be dc, radio frequency, 81 or pulsed.…”

Section: B Modifications To the Magnetron Sputtering Dischargementioning

confidence: 99%

High power impulse magnetron sputtering discharge

Guðmundsson¹,

Brenning²,

Lundin³

et al. 2012

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

637

446

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The high power impulse magnetron sputtering (HiPIMS) discharge is a recent addition to plasma based sputtering technology. In HiPIMS, high power is applied to the magnetron target in unipolar pulses at low duty cycle and low repetition frequency while keeping the average power about 2 orders of magnitude lower than the peak power. This results in a high plasma density, and high ionization fraction of the sputtered vapor, which allows better control of the film growth by controlling the energy and direction of the deposition species. This is a significant advantage over conventional dc magnetron sputtering where the sputtered vapor consists mainly of neutral species. The HiPIMS discharge is now an established ionized physical vapor deposition technique, which is easily scalable and has been successfully introduced into various industrial applications. The authors give an overview of the development of the HiPIMS discharge, and the underlying mechanisms that dictate the discharge properties. First, an introduction to the magnetron sputtering discharge and its various configurations and modifications is given. Then the development and properties of the high power pulsed power supply are discussed, followed by an overview of the measured plasma parameters in the HiPIMS discharge, the electron energy and density, the ion energy, ion flux and plasma composition, and a discussion on the deposition rate. Finally, some of the models that have been developed to gain understanding of the discharge processes are reviewed, including the phenomenological material pathway model, and the ionization region model.

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Section: B Modifications To the Magnetron Sputtering Dischargementioning

confidence: 99%

High power impulse magnetron sputtering discharge

Guðmundsson¹,

Brenning²,

Lundin³

et al. 2012

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

637

446

View full text Add to dashboard Cite

show abstract

“…To overcome these problems, magnetron sputtering and, more recently, unbalanced magnetron sputtering processes have been developed. 18 Both conventional and unbalanced magnetrons essentially consists of a water cooled target with magnets arranged behind it in such a way that a magnetic trap is created for charged particles, such as Ar ions, in front of the target. This arrangement also produces a magnetic field perpendicular to the electric field at the target which confines the electrons in the plasma to a region near the target resulting in an increased ionisation and a much denser plasma in this region.…”

Section: Closed Field Unbalanced Magnetron Sputter Ion Plating (Cfubmmentioning

confidence: 99%

“…This arrangement also produces a magnetic field perpendicular to the electric field at the target which confines the electrons in the plasma to a region near the target resulting in an increased ionisation and a much denser plasma in this region. 18 The main difference between conventional and unbalanced magnetron sputtering is the degree of confinement of the plasma. In conventional magnetrons, the plasma is strongly confined to the target region and the substrates placed beyond this region lie in a very low-density plasma resulting in a little ion bombardment of the growing film necessary to produce good quality and fully dense coatings of certain materials.…”

Section: Closed Field Unbalanced Magnetron Sputter Ion Plating (Cfubmmentioning

confidence: 99%

Properties of NiAl and Ni-Al-N Thin Films Deposited by Closed Field Unbalanced Magnetron Sputter Ion Plating Using Elemental Ni and Al Targets

Baig

Ahmed²,

Khalid³

et al. 2009

J. Nanosci. Nanotech.

Self Cite

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Approximately 1 microm thick NiAl and Ni-Al-N thin films have been deposited from individual elemental Ni (99.5% pure) and Al (99.5% pure) targets onto glass and stainless steel 316 substrates using closed field unbalanced magnetron sputter ion platting (CFUBMSIP) process. The films have been characterized using stylus profilometry, energy dispersive spectroscopy (EDAX), X-ray diffractometry (XRD) and atomic force microscopy (AFM). The X-ray diffraction patterns of both types of thin films produced confirmed the formation of beta-NiAl phase. The EDAX results revealed that all of the NiAl thin films produced exhibited the near equiatomic NiAl phase with the best results given by the one deposited using 300 Watts DC power for Ni and 400 Watts DC power for Al targets respectively. However, the Ni-Al-N thin films showed a Ni-rich NiAl phase. AFM results of both types of films produced carried out on glass samples exhibited that the coatings have quite a smooth surface with surface roughness in nanometres range.

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“…The deposition technique and the processing conditions have a direct influence on the chemical composition, the structure, and the physical, mechanical, and surface properties [7]. Various techniques have been used for depositing a carbon-based layer, including ion-beam assisted deposition (IBAD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), sputtering, and filtered cathodic vacuum arc deposition (FCVA) [8][9][10][11][12]. The IBAD method is very promising for the deposition of carbon-based layers.…”

Section: Introductionmentioning

confidence: 99%

Protective Sliding Carbon-Based Nanolayers Prepared by Argon or Nitrogen Ion-Beam Assisted Deposition on Ti6Al4V Alloy

Vlcak

Jirka

2016

Journal of Nanomaterials

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The microstructure and the surface properties of samples coated by carbon-based nanolayer were investigated in an effort to increase the surface hardness and reduce the coefficient of friction of the Ti6Al4V alloy. Protective carbon-based nanolayers were fabricated by argon or nitrogen ion-beam assisted deposition at ion energy of 700 eV on Ti6Al4V substrates. The Raman spectra indicated that nanolayers had a diamond-like carbon character with sp2rich bonds. The TiC and TiN compounds formed in the surface area were detected by X-ray diffraction. Nanoscratch tests showed increased adhesion of a carbon-based nanolayer deposited with ion assistance in comparison with a carbon nanolayer deposited without ion assistance. The results showed that argon ion assistance leads to greater nanohardness than a sample coated by a carbon-based nanolayer with nitrogen ion assistance. A more than twofold increase in nanohardness and a more than fivefold decrease in the coefficient of friction were obtained for samples coated by a carbon-based nanolayer with ion assistance, in comparison with the reference sample.

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Novel engineering coatings produced by closed-field unbalanced magnetron sputtering

Cited by 19 publications

References 5 publications

High power impulse magnetron sputtering discharge

High power impulse magnetron sputtering discharge

Properties of NiAl and Ni-Al-N Thin Films Deposited by Closed Field Unbalanced Magnetron Sputter Ion Plating Using Elemental Ni and Al Targets

Protective Sliding Carbon-Based Nanolayers Prepared by Argon or Nitrogen Ion-Beam Assisted Deposition on Ti6Al4V Alloy

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