2015
DOI: 10.1088/1742-6596/660/1/012084
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Novel Fabrication Process for Micro Thermoelectric Generators (μTEGs)

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Cited by 8 publications
(3 citation statements)
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“…Thermoelectric generators and heat flux sensors commonly consist of a multitude of thermocouples that are electrically connected in series while thermally connected in parallel [22], [23], [24], [25], [26]. In order to explore the potential of Bi 2 Se 3 based sensors for temperature and heat flux measurements, a process for such a device was developed here where the electrodeposition process for Bi 2 Se 3 can be integrated, see Fig.…”
Section: B Synthesis Of Bi 2 Se 3 Based Devicesmentioning
confidence: 99%
“…Thermoelectric generators and heat flux sensors commonly consist of a multitude of thermocouples that are electrically connected in series while thermally connected in parallel [22], [23], [24], [25], [26]. In order to explore the potential of Bi 2 Se 3 based sensors for temperature and heat flux measurements, a process for such a device was developed here where the electrodeposition process for Bi 2 Se 3 can be integrated, see Fig.…”
Section: B Synthesis Of Bi 2 Se 3 Based Devicesmentioning
confidence: 99%
“…All of these fabrication techniques rely on several lithography and deposition steps at least in part requesting a clean room environment. 17 Modification with respect to the used photoresist and the electrical top contacts were explored. 18 Within this article we report on the electrochemical deposition of ternary Bi 2 (Te x Se 1-x ) 3 and (Bi x Sb 1-x ) 2 Te 3 films for the integration into micro thermoelectric coolers.…”
mentioning
confidence: 99%
“…22 Electroplating of thermoelectric thick film deposition and device integration was recently reviewed, 23 and the fabrication and characterization of integrated devices based on electrochemical deposition techniques was successfully realized in several studies. 17,18,24,25 However, the reported electrodeposited materials above mentioned, especially for the antimony telluride based films present still high roughness and porous or dendritic structures. In this work the electrochemical conditions have been further optimized in order to demonstrate highly compact films of both ternary compositions which are in fact reliable for their usage as components of a μ-TEC.…”
mentioning
confidence: 99%