Novel fast cure and reworkable underfill materials

Ma, B.; Tong, Q.K.; Savoca, A.; DeBarros, T.

doi:10.1109/adhes.1998.742035

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat.

DOI: 10.1109/adhes.1998.742035

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Novel fast cure and reworkable underfill materials

B. Ma

Q.K. Tong²,

A. Savoca³

et al.

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“…Initial capillary fl ow underfi ll showed high viscosity, slow fl ow, and curing times of ~ 6 hrs. Faster fl ow and faster cure materials were quickly developed by a number of suppliers [29]. Pre-applied underfi ll (also called "no fl ow") where fl uxing, solder refl ow, and underfi ll curing occur in the same process sequence, requires formulations that are stable at solder refl ow temperatures and are then cured at higher temperatures [30].…”

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3D and MEMS Packaging

2011

Advancing Microelectronics Magazine

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On the Cover: Pressure distribution over the bottom side of the substrate and its bond pads (as imaged by Topaq Analysis System) IMAPS -International Microelectronics AndPackaging Society 611 2nd Street, NE Washington, DC 20002 Tel: (202) Inside Back Cover Calendar of Events U P C O M I N G E V E N T S F R O M T H E P R E S I D E N T President's MessageMy deepest sympathy and condolence to the Japanese people affected by the recent earthquake and the aftermath that followed. They are in our thoughts and prayers. I have just returned from the International Conference on Electronic Packaging held in Nara, Japan. We have a special bond with the Japanese people because of the common professional interest in microelectronics and electronic packaging industries. Many electronic companies have been directly hit by this disaster.We just had a successful Device Packaging Conference (DPC) in Scottsdale. This conference had leading-edge papers on topics like 3D, wafer-level packaging and fl ipchip technologies. The exhibition had the mix of equipment, materials suppliers and service providers for the technologies relating to conference topics. I have to give kudos to Dr. Phil Garrou and his technical chairs, who did an excellent job of making it happen.The upcoming ATW on High Reliability Microelectronics for Military Applications will address some of these issues. This event will be held on May 17-19, 2011, Holiday Inn Baltimore-BWI International Airport (soon to be the Doubletree BWI -March 2011), Maryland. Greg Caswell and his team have put together an excellent program, another example of great professional volunteerism.As IMAPS President, I am fi nding out that key to a successful event are the general chairs and technical chairs.Our society needs talented and passionate members to organize successful events like DPC. I am requesting of all IMAPS members that if you or someone you know has a passion and talent to hold one of the IMAPS technical events, we need you badly. Please contact me, IMAPS Executive Council Members, or the IMAPS Director or staff to further discuss your ideas on a technical event, which could be a webinar, Advanced Technology Workshop or a conference.So please think what you could achieve if you and a few of your IMAPS friends put your heads together in organizing an event. Volunteer and you will fi nd more rewards than you expected.The focus of this issue is 3D and MEMS Packaging. Today, 3D packaging is the topic of discussion at several packaging conferences including DPC. 3D packaging will enable miniaturization of electronics as never achieved before. Companies are exploring technologies ranging from simple 3D stacking of packages to 3D stacking of ICs using thru-silicon-vias. The infrastructure to fabricate 3D electronics, which was non-existent just a few years ago, is becoming more available. The key to the success of both 3D packaging and MEMS packaging will be low cost and higher functional densities. I hope you enjoy reading the articles on these topics in this issue. Long Beach...

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3D and MEMS Packaging

2011

Advancing Microelectronics Magazine

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Novel fast cure and reworkable underfill materials

Cited by 1 publication

References 5 publications

3D and MEMS Packaging

3D and MEMS Packaging

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