“…Several groups have followed the challenging target to use low-cost polymer substrates, in spite of the more stringent limitations on the maximum processing temperatures, starting from the seminal work by N. D. Young at Philips Res. Lab (UK) [12,13] and followed by the groups at Lawrence Livermore National Lab. [14], Sony [15], Electronics and Telecommunications Research Institute (ETRI) [16][17][18], Samsung Advanced Institute of Technology (SAIT) [19][20][21], Korea Electronics Technology Institute (KETI) [22,23] and at University of Rennes [24,25], ultra-low-temperature polycrystalline silicon (ULTPS) devices were demonstrated.…”