2021
DOI: 10.1016/j.rinp.2021.104718
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Novel gate air cavity GaN HEMTs design for improved RF and DC performance

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Cited by 2 publications
(1 citation statement)
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“…Under HTRB conditions, the positive shift in V TH is temperature-dependent due to electron trapping by defects created by hole emission and hot holes. The choice of gate metal material can be further optimized next, aiming to balance the relationship between output characteristics, V TH , and reliability, which can achieve a greater breakthrough in device performance [ 45 ]. In Figure 19 a, a proposed air-cavity-P-GaN connected HEMT is shown.…”
Section: Conclusion and Future Perspectivesmentioning
confidence: 99%
“…Under HTRB conditions, the positive shift in V TH is temperature-dependent due to electron trapping by defects created by hole emission and hot holes. The choice of gate metal material can be further optimized next, aiming to balance the relationship between output characteristics, V TH , and reliability, which can achieve a greater breakthrough in device performance [ 45 ]. In Figure 19 a, a proposed air-cavity-P-GaN connected HEMT is shown.…”
Section: Conclusion and Future Perspectivesmentioning
confidence: 99%