Novel high temperature polymeric encapsulation material for extreme environment electronics packaging

Phua, Eric Jian Rong; Liu, Ming; Cho, Bokun; Qing, Liu; Amini, Shahrouz; Hu, Xiao-Long; Gan, Chee Lip

doi:10.1016/j.matdes.2017.12.029

Cited by 44 publications

(14 citation statements)

References 32 publications

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“…In order to estimate level of stress caused by vibration tests in PCB 1 strain values measured at resonant frequencies were recalculated [10,11] to stress values by Hooke's law for linear deformation. Mean values of stress were calculated for PCB substrate material (fiberglass) whose elasticity module is E = 0.210 5 MPa.…”

Section: Fig 1 Layout Of Vibration Sensor and Strain Gauges On Prinmentioning

confidence: 99%

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Methods for Vibration Reduction in Enclosed Electronic Packages

et al. 2019

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Excitation and transmission of vibration inside electronic packages are strongly connected with mechanical characteristics of their enclosure, which are in the objective for the current research aimed at developing methods and means to reduce vibration inside the enclosure case. The main idea of the introduced methods is in creating elastic and dissipative mechanical joints between structural elements, which appear to be the links for vibration transmission, inside and outside of the electronic package enclosure. The effectiveness of developed methods is proved by experimental verification and theoretical foundation.

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Section: Fig 1 Layout Of Vibration Sensor and Strain Gauges On Prinmentioning

confidence: 99%

“…Despite variety of vibration isolators [4][5][6][7] the reliable and simple wideband isolator applicable to electronic packages has yet to be created. Now the close attention is paid to damping methods having inherent drawbacks though.…”

Section: Introductionmentioning

confidence: 99%

Methods for Vibration Reduction in Enclosed Electronic Packages

et al. 2019

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“…1,2 The resulting excellent thermal-mechanical, low water absorption, flame retardant, and chemical resistant features make phthalonitrile resins suitable candidates for advanced composite matrices 3−5 or high-temperature microelectronic encapsulations. 6 A major obstacle for the scalable application of phthalonitrile resins was inadequate processability. 7 Generally, the manufacturing strategies for advanced composites can be divided into two categories: liquid molding and prepreg molding.…”

Section: Introductionmentioning

confidence: 99%

Phthalonitrile-Terminated Silicon-Containing Oligomers: Synthesis, Polymerization, and Properties

Wang

Han

Guo

et al. 2019

Ind. Eng. Chem. Res.

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A novel silicon-containing phthalonitrile-terminated fluorene-based oligomer was synthesized by a novel method, and the structure was characterized by Fourier transfrom infrared spectroscopy, 1H NMR, and gel permeation chromatography. The prepolymer was obtained by blending the oligomer with curing agent, and the curing behavior was systematically studied by differential scanning calorimetry, infrared, and rheology tests. The oligomer exhibited excellent solubility, even in acetone under room temperature, which greatly facilitated prepreg preparation. The quartz fiber-reinforced composites were prepared by a hot-pressing process. The cured polymers and composites possessed excellent thermal properties. Under inert atmosphere, the maximum 1000 °C residual weight was 88% and the 5% thermal degradation temperature was 662 °C. More importantly, no obviously decrease in storage modulus was detected until 500 °C, suggesting sufficiently high heat resistance. Additionally, the composites exhibited outstanding flame retardant, ablative, and dielectric properties. Consequently, the current resin could be potentially applied in either high-temperature structural or functional composites.

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“…Common epoxy compounds or silicone gels show limited lifetime above 200°C because of thermal degradation effects. Thus, improved polymeric mold compounds, operating even up to 300°C, are under development [8]. However, polymer-based encapsulation materials are limited in thermal conductivity (<2 W/ [m•K]) or workability.…”

Section: R I Introductionmentioning

confidence: 99%

iMAPS 2019 52nd International Symposium on Microelectronics BOSTON September 30 – October 3, 2019

2019

Advancing Microelectronics Magazine

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Novel high temperature polymeric encapsulation material for extreme environment electronics packaging

Cited by 44 publications

References 32 publications

Methods for Vibration Reduction in Enclosed Electronic Packages

Methods for Vibration Reduction in Enclosed Electronic Packages

Phthalonitrile-Terminated Silicon-Containing Oligomers: Synthesis, Polymerization, and Properties

iMAPS 2019 52nd International Symposium on Microelectronics BOSTON September 30 – October 3, 2019

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