Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field

Abstract

The main scope of this research is to investigate the impact of rotating magnetic field (RMF) on the physical properties of the Sn-0.5Ag-0.5Cu-2.0Sb-0.1Al (SAC0505SbAl) solder alloy. The application of RMF during molten alloy cooling showed prominent effect on the morphology, thermal properties, and the consequent mechanical characteristics. It was shown that the dendritic morphology was changed from columnar dendrites to equiaxed grains with the application of RMF. In addition, RMF processing modified the eutectic phases in the alloy matrix. These notable modifications have resulted in a substantial increase in ductility (* 30%) with a slight decrease in tensile parameters (UTS and YS). Such effects could enhance elastic compliance and plastic energy dissipation ability of solder alloys, which plays superbly fundamental function in drop-impact reliability. Differential scanning calorimetry (DSC) analysis reveals that significant decrease in pasty range (from 10.8 to 7.5°C) and undercooling (from 13.1 to 9.0°C) was attained after applying RMF. The stress exponent (n), the activation energy (Q), and deformation mechanism of the SAC0505SbAl alloy processed with and without RMF were discussed in detail. The obtained results are certainly expected to fill the knowledge gap about the behavior of these recently developed solder alloys under the effect of RMF that are potential alternatives as Pb-free interconnecting material in microelectronic packaging industry.

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO2 nanoparticles via vacuum melting process

“…Onset The pasty range of SZ, SZN901, SZN902, SZN903, and SZ-ZrO 2 is 10.4, 11.2, 8.2, 7.1, and 12.3 °C respectively. The addition of 0.1 wt.% of Ni expands slightly the temperature interval of the pasty range, which is close to 11.5 °C for Sn-37Pb solders [45] but increasing the ratios of Ni addition decreases the pasty range more than the eutectic Sn-9Zn, as shown in table 2 which allowed better microstructure formation of the Ni added into solder alloys. The ternary alloys have a narrow pasty range with good solidus temperature, particularly the SZN903 solder alloy due to the solder is achieve the composition near to the eutectic point and can be candidate for electronic solder application.…”

Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder

“…These indicated that the incorporation of Sb can evidently improve the mechanical properties of SAC105 alloy. The microstructure characteristics of solder alloys inevitably control their mechanical properties (El-Taher et al , 2021; Hammad and Ragab, 2019). The heterogeneous nucleation points increased with the Sb doping, which resulted in the diminution of grain size and the generation of more grain boundaries to hinder dislocation movement (Sun et al , 2016; Bakshi and Agarwal, 2011; Sharma et al , 2015; Billah and Chen, 2015).…”

Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys

“…When the alloy was stressed, the smaller grains of the alloy could improve the energy consumption of dislocation operation, but when the relative movement between grains occurred, the smaller grains meant more grain boundaries. Sb accumulated at the grain boundaries under the action of Lorentz magnetic force, leading to more obvious lubrication at grain boundaries and promoting the relative sliding of grains (El-Taher et al , 2021; Bai et al , 2021). Therefore, the tensile strength of the Sn-3.5Ag-0.5Sb alloy decreased under the magnetic field.…”

“…A new method is to use a rotating magnetic field (RMF) during the solidification of solder alloys (Ripley et al , 2015). The RMF influences the flow and coagulation of molten metals, which eliminates defects, reduces grain size and ultimately improves the overall performance of solder joints (El-Taher et al , 2021; Hammad and Ragab, 2019; Ibrahiem and El-Daly, 2019). Hammad (Hammad and Ragab, 2020) investigated the influence of the RMF on the fine texture and mechanical performance of SACZ (Sn-2.0Ag-0.5Cu-2.0Zn) and found that the grain size of β -Sn and intermetallic compounds (IMCs) decreased and the mechanical performance was enhanced under the RMF.…”